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James Douglas Wehrly, JR.

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  • Austin, TX, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    High density IC module
    • Patent number 7,759,791
    • Issue date Jul 20, 2010
    • Entorian Technologies LP
    • Julian Partridge
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit module with thermal casing systems
    • Patent number 7,737,549
    • Issue date Jun 15, 2010
    • Entorian Technologies LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacked modules and method
    • Patent number 7,719,098
    • Issue date May 18, 2010
    • Entorian Technologies LP
    • James Douglas Wehrly, Jr.
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked module systems
    • Patent number 7,656,678
    • Issue date Feb 2, 2010
    • Entorian Technologies, LP
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Low profile stacking system and method
    • Patent number 7,626,273
    • Issue date Dec 1, 2009
    • Entorian Technologies, LP
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat sink for a high capacity thin module system
    • Patent number 7,626,259
    • Issue date Dec 1, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flex circuit constructions for high capacity circuit module systems...
    • Patent number 7,616,452
    • Issue date Nov 10, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Memory card and method for devising
    • Patent number 7,608,920
    • Issue date Oct 27, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Integrated circuit stacking system
    • Patent number 7,606,048
    • Issue date Oct 20, 2009
    • Enthorian Technologies, LP
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Memory card and method for devising
    • Patent number 7,605,454
    • Issue date Oct 20, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Compact module system and method
    • Patent number 7,606,050
    • Issue date Oct 20, 2009
    • Entorian Technologies, LP
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flex-based circuit module
    • Patent number 7,595,550
    • Issue date Sep 29, 2009
    • Entorian Technologies, LP
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit stacking system
    • Patent number 7,586,758
    • Issue date Sep 8, 2009
    • Entorian Technologies, LP
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacked module systems and methods
    • Patent number 7,572,671
    • Issue date Aug 11, 2009
    • Entorian Technologies, LP
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Memory expansion and integrated circuit stacking system and method
    • Patent number 7,542,304
    • Issue date Jun 2, 2009
    • Entorian Technologies, LP
    • Russell Rapport
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Optimized mounting area circuit module system and method
    • Patent number 7,542,297
    • Issue date Jun 2, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit stacking system and method
    • Patent number 7,524,703
    • Issue date Apr 28, 2009
    • Entorian Technologies, LP
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Composite core circuit module system and method
    • Patent number 7,511,969
    • Issue date Mar 31, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Managed memory component
    • Patent number 7,508,069
    • Issue date Mar 24, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacked integrated circuit module
    • Patent number 7,508,058
    • Issue date Mar 24, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacking system and method
    • Patent number 7,495,334
    • Issue date Feb 24, 2009
    • Entorian Technologies, LP
    • Russell Rapport
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Modularized die stacking system and method
    • Patent number 7,485,951
    • Issue date Feb 3, 2009
    • Entorian Technologies, LP
    • David L. Roper
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stackable micropackages and stacked modules
    • Patent number 7,468,553
    • Issue date Dec 23, 2008
    • Entorian Technologies, LP
    • Leland Szewerenko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    High capacity thin module system
    • Patent number 7,459,784
    • Issue date Dec 2, 2008
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit module with thermal casing systems
    • Patent number 7,446,410
    • Issue date Nov 4, 2008
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    High capacity thin module system
    • Patent number 7,443,023
    • Issue date Oct 28, 2008
    • Entorian Technologies, LP
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacked module systems and methods
    • Patent number 7,371,609
    • Issue date May 13, 2008
    • Staktek Group L.P.
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit stacking system and method
    • Patent number 7,335,975
    • Issue date Feb 26, 2008
    • Staktek Group L.P.
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacked module systems and method
    • Patent number 7,323,364
    • Issue date Jan 29, 2008
    • Staktek Group L.P.
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Stacked module systems and methods
    • Patent number 7,310,458
    • Issue date Dec 18, 2007
    • Staktek Group L.P.
    • James Douglas Wehrly, Jr.
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Package-Borne Selective Enablement Stacking
    • Publication number 20090294946
    • Publication date Dec 3, 2009
    • Leland Szewerenko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stacked Module Systems and Methods
    • Publication number 20090298230
    • Publication date Dec 3, 2009
    • Staktek Group, L.P.
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
    • Publication number 20090273069
    • Publication date Nov 5, 2009
    • James W. Cady
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stacked Integrated Circuit Module
    • Publication number 20090170243
    • Publication date Jul 2, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, JR.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Managed Memory Component
    • Publication number 20090160042
    • Publication date Jun 25, 2009
    • Entorian Technologies, LP
    • James Douglas Wehrly, JR.
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Low Profile Stacking System and Method
    • Publication number 20090124045
    • Publication date May 14, 2009
    • Julian Partridge
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Module with Thermal Casing Systems
    • Publication number 20090052124
    • Publication date Feb 26, 2009
    • Entorian Technologies, L.P. (formerly Staktek Group, L.P)
    • James Douglas Wehrly, JR.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    High Capacity Thin Module System
    • Publication number 20090046431
    • Publication date Feb 19, 2009
    • Staktek Group. L.P.
    • James Douglas Wehrly, Jr.
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR