James W. Cady

Person

Shelburne, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die module system
- Patent number 7,768,796
- Issue date Aug 3, 2010
- Entorian Technologies LP
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Grant
Low profile stacking system and method
- Patent number 7,626,273
- Issue date Dec 1, 2009
- Entorian Technologies, LP
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system
- Patent number 7,606,048
- Issue date Oct 20, 2009
- Enthorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module thermal management system and method
- Patent number 7,606,049
- Issue date Oct 20, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact module system and method
- Patent number 7,606,050
- Issue date Oct 20, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin module system and method
- Patent number 7,602,613
- Issue date Oct 13, 2009
- Entorian Technologies, LP
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Grant
Flex-based circuit module
- Patent number 7,595,550
- Issue date Sep 29, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system
- Patent number 7,586,758
- Issue date Sep 8, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and integrated circuit stacking system and method
- Patent number 7,542,304
- Issue date Jun 2, 2009
- Entorian Technologies, LP
- Russell Rapport
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 7,524,703
- Issue date Apr 28, 2009
- Entorian Technologies, LP
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking system and method
- Patent number 7,495,334
- Issue date Feb 24, 2009
- Entorian Technologies, LP
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modularized die stacking system and method
- Patent number 7,485,951
- Issue date Feb 3, 2009
- Entorian Technologies, LP
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die module system
- Patent number 7,423,885
- Issue date Sep 9, 2008
- Entorian Technologies, LP
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 7,335,975
- Issue date Feb 26, 2008
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and chip scale stacking system and method
- Patent number 7,256,484
- Issue date Aug 14, 2007
- Staktek Group L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pitch change and chip scale stacking system and method
- Patent number 7,202,555
- Issue date Apr 10, 2007
- Staktek Group L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile stacking system and method
- Patent number 7,180,167
- Issue date Feb 20, 2007
- Staktek Group L.P.
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile chip scale stacking system and method
- Patent number 7,094,632
- Issue date Aug 22, 2006
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit connector for stacked chip module
- Patent number 7,066,741
- Issue date Jun 27, 2006
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch change and chip scale stacking system
- Patent number 7,053,478
- Issue date May 30, 2006
- Staktek Group L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile chip scale stacking system and method
- Patent number 7,026,708
- Issue date Apr 11, 2006
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and chip scale stacking system and method
- Patent number 6,955,945
- Issue date Oct 18, 2005
- Staktek Group L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 6,956,284
- Issue date Oct 18, 2005
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit stacking system and method
- Patent number 6,940,729
- Issue date Sep 6, 2005
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory expansion and chip scale stacking system and method
- Patent number 6,914,324
- Issue date Jul 5, 2005
- Staktek Group L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wide data path stacking system and method
- Patent number 6,618,257
- Issue date Sep 9, 2003
- Staktek Group, L.P.
- James Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip scale stacking system and method
- Patent number 6,576,992
- Issue date Jun 10, 2003
- Staktek Group L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit connector for stacked chip module
- Patent number 6,572,387
- Issue date Jun 3, 2003
- Staktek Group, L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rambus stakpak
- Patent number 6,404,662
- Issue date Jun 11, 2002
- Staktek Group, L.P.
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Grant
Warp-resistent ultra-thin integrated circuit package fabrication me...
- Patent number 6,194,247
- Issue date Feb 27, 2001
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD
- Publication number 20090273069
- Publication date Nov 5, 2009
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Profile Stacking System and Method
- Publication number 20090124045
- Publication date May 14, 2009
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE MODULE SYSTEM
- Publication number 20080278924
- Publication date Nov 13, 2008
- Entorian Technologies, L.P. (formerly Staktek Group L.P.)
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Application
Low profile chip scale stacking system and method
- Publication number 20080211077
- Publication date Sep 4, 2008
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modularized Die Stacking System and Method
- Publication number 20080067662
- Publication date Mar 20, 2008
- Staktek Group. L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory Module System and Method
- Publication number 20070126125
- Publication date Jun 7, 2007
- Staktek Group L.P.
- Russell Rapport
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Module System and Method
- Publication number 20070126124
- Publication date Jun 7, 2007
- Staktek Group L.P.
- Russell Rapport
- G11 - INFORMATION STORAGE
Information Patent Application
Low Profile Stacking System and Method
- Publication number 20070114649
- Publication date May 24, 2007
- Staktek Group L.P., a Texas Limited Partnership
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin Module System and Method
- Publication number 20070115017
- Publication date May 24, 2007
- Staktek Group L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
Low Profile Stacking System and Method
- Publication number 20070117262
- Publication date May 24, 2007
- Staktek Group L.P., a Texas Limited Partnership
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory module system and method
- Publication number 20060261449
- Publication date Nov 23, 2006
- Staktek Group. L.P.
- Russell Rapport
- G11 - INFORMATION STORAGE
Information Patent Application
Systems, methods, and apparatus for generating ball-out matrix conf...
- Publication number 20060175693
- Publication date Aug 10, 2006
- Staktek Group, L.P.
- James W. Cady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking system and method
- Publication number 20060131716
- Publication date Jun 22, 2006
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking system and method
- Publication number 20060091521
- Publication date May 4, 2006
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin module system and method
- Publication number 20060050492
- Publication date Mar 9, 2006
- Staktek Group, L.P.
- Paul Goodwin
- G11 - INFORMATION STORAGE
Information Patent Application
Compact module system and method
- Publication number 20060050592
- Publication date Mar 9, 2006
- Staktek Group. L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Minimized profile circuit module systems and methods
- Publication number 20060048385
- Publication date Mar 9, 2006
- Staktek Group. L.P.
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Application
Module thermal management system and method
- Publication number 20060049502
- Publication date Mar 9, 2006
- Staktek Group, L.P.
- Paul Goodwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die module system and method
- Publication number 20060050498
- Publication date Mar 9, 2006
- Staktek Group. L.P.
- James W. Cady
- G11 - INFORMATION STORAGE
Information Patent Application
Stacked integrated circuit cascade signaling system and method
- Publication number 20060043558
- Publication date Mar 2, 2006
- Staktek Group L.P.
- James W. Cady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit stacking system and method
- Publication number 20060008945
- Publication date Jan 12, 2006
- Staktek Group, L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking system and method
- Publication number 20050280135
- Publication date Dec 22, 2005
- Staktek Group. L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex-based circuit module
- Publication number 20050263872
- Publication date Dec 1, 2005
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pitch change and chip scale stacking system and method
- Publication number 20050146011
- Publication date Jul 7, 2005
- Staktek Group, L.P.
- David L. Roper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low profile stacking system and method
- Publication number 20050146031
- Publication date Jul 7, 2005
- Staktek Group, L.P.
- Julian Partridge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory expansion and chip scale stacking system and method
- Publication number 20050067683
- Publication date Mar 31, 2005
- Staktek Group. L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory expansion and chip scale stacking system and method
- Publication number 20050062144
- Publication date Mar 24, 2005
- Staktek Group, L.P.
- Russell Rapport
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory expansion and integrated circuit stacking system and method
- Publication number 20050057911
- Publication date Mar 17, 2005
- Staktek Group, L.P.
- Russell Rapport
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked module systems and methods
- Publication number 20050056921
- Publication date Mar 17, 2005
- Staktek Group. L.P.
- James Douglas Wehrly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit stacking system and method
- Publication number 20050041402
- Publication date Feb 24, 2005
- Staktek Group, L.P.
- James W. Cady
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James W. Cady

Person

Patents Grantslast 30 patents

Die module system

Low profile stacking system and method

Integrated circuit stacking system

Module thermal management system and method

Compact module system and method

Thin module system and method

Flex-based circuit module

Integrated circuit stacking system

Memory expansion and integrated circuit stacking system and method

Integrated circuit stacking system and method

Stacking system and method

Modularized die stacking system and method

Die module system

Integrated circuit stacking system and method

Memory expansion and chip scale stacking system and method

Pitch change and chip scale stacking system and method

Low profile stacking system and method

Low profile chip scale stacking system and method

Flexible circuit connector for stacked chip module

Pitch change and chip scale stacking system

Low profile chip scale stacking system and method

Memory expansion and chip scale stacking system and method

Integrated circuit stacking system and method

Integrated circuit stacking system and method

Memory expansion and chip scale stacking system and method

Wide data path stacking system and method

Chip scale stacking system and method

Flexible circuit connector for stacked chip module

Rambus stakpak

Warp-resistent ultra-thin integrated circuit package fabrication me...

Patents Applicationslast 30 patents

LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHOD

Low Profile Stacking System and Method

DIE MODULE SYSTEM

Low profile chip scale stacking system and method

Modularized Die Stacking System and Method

Memory Module System and Method

Memory Module System and Method

Low Profile Stacking System and Method

Thin Module System and Method

Low Profile Stacking System and Method

Memory module system and method

Systems, methods, and apparatus for generating ball-out matrix conf...

Stacking system and method

Stacking system and method

Thin module system and method

Compact module system and method

Minimized profile circuit module systems and methods

Module thermal management system and method

Die module system and method

Stacked integrated circuit cascade signaling system and method

Integrated circuit stacking system and method

Stacking system and method

Flex-based circuit module

Pitch change and chip scale stacking system and method

Low profile stacking system and method

Memory expansion and chip scale stacking system and method

Memory expansion and chip scale stacking system and method

Memory expansion and integrated circuit stacking system and method

Stacked module systems and methods

Integrated circuit stacking system and method