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MULTI PROGRAMABLE-DIE MODULE
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Publication number 20240145434
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Publication date May 2, 2024
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Intel Corporation
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Mahesh Kumashikar
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H01 - BASIC ELECTRIC ELEMENTS
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INTERPOSER POWER CORRIDOR
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Publication number 20240145394
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Publication date May 2, 2024
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Intel Corporation
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Poh Boon KHOO
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H01 - BASIC ELECTRIC ELEMENTS
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COMPOSITE ELECTRONIC COMPONENT
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Publication number 20240136342
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Publication date Apr 25, 2024
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Murata Manufacturing Co., Ltd.
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Yukihiro FUJITA
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20240128255
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Publication date Apr 18, 2024
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Intel Corporation
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Adel A. Elsherbini
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE
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Publication number 20240120281
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Publication date Apr 11, 2024
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Ping-Jung Yang
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE
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Publication number 20240112978
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Publication date Apr 4, 2024
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Advanced Semiconductor Engineering, Inc.
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Vikas GUPTA
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H01 - BASIC ELECTRIC ELEMENTS
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POROUS POLYMER DIELECTRIC LAYER ON CORE
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Publication number 20240113009
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Publication date Apr 4, 2024
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Intel Corporation
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Whitney Bryks
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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TSV TESTING
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Publication number 20240094280
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Publication date Mar 21, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Lee D. Whetsel
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240088070
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chung-Yi Hsu
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H01 - BASIC ELECTRIC ELEMENTS
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