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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05005
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Patents Grants
last 30 patents
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Patent Grant
Shielding structures
Patent number
11,855,022
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and package assembly including the same
Patent number
11,855,025
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chita Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive barrier direct hybrid bonding
Patent number
11,830,838
Issue date
Nov 28, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to stack structures including passivati...
Patent number
11,804,460
Issue date
Oct 31, 2023
Skyworks Solutions, Inc.
Jiro Yota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
11,798,905
Issue date
Oct 24, 2023
Lapis Semiconductor Co., Ltd.
Takashi Shimada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
Patent number
11,664,335
Issue date
May 30, 2023
Semikron Elektronik GmbH & Co., KG
Wolfgang-Michael Schulz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
Patent number
11,640,948
Issue date
May 2, 2023
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structures with integrated passive component
Patent number
11,626,363
Issue date
Apr 11, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including a thick metal layer
Patent number
11,616,018
Issue date
Mar 28, 2023
Samsung Electronics Co., Ltd.
Juik Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
Patent number
11,495,567
Issue date
Nov 8, 2022
Dialog Semiconductor (UK) Limited
Habeeb Mohiuddin Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
11,476,291
Issue date
Oct 18, 2022
Sony Corporation
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package devices and method for forming semiconductor...
Patent number
11,393,784
Issue date
Jul 19, 2022
Infineon Technologies AG
Roland Rupp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielding structures
Patent number
11,380,639
Issue date
Jul 5, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
11,342,309
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive barrier direct hybrid bonding
Patent number
11,264,345
Issue date
Mar 1, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack structures in electronic devices including passivation layers...
Patent number
11,257,774
Issue date
Feb 22, 2022
Skyworks Solutions, Inc.
Jiro Yota
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including a thick metal layer
Patent number
11,133,253
Issue date
Sep 28, 2021
Samsung Electronics Co., Ltd.
Juik Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic light emitting diode array substrate and electronic device
Patent number
11,063,108
Issue date
Jul 13, 2021
ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
Liman Peng
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device manufacturing method and semiconductor device
Patent number
11,056,451
Issue date
Jul 6, 2021
Sumitomo Electric Device Innovations, Inc.
Keita Matsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scheme for connector site spacing and resulting structures
Patent number
10,985,114
Issue date
Apr 20, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Feng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
Patent number
10,950,564
Issue date
Mar 16, 2021
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device structure comprising a plurality of metal oxid...
Patent number
10,943,873
Issue date
Mar 9, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
Patent number
10,916,516
Issue date
Feb 9, 2021
Xilinx, Inc.
Martin Newman
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
10,867,944
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company Ltd.
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielding structures
Patent number
10,861,810
Issue date
Dec 8, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
Patent number
10,797,012
Issue date
Oct 6, 2020
Dialog Semiconductor (UK) Limited
Habeeb Mohiuddin Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dummy flip chip bumps for reducing stress
Patent number
10,734,347
Issue date
Aug 4, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Yu Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
10,714,457
Issue date
Jul 14, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
10,636,748
Issue date
Apr 28, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
10,600,838
Issue date
Mar 24, 2020
Sony Corporation
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
Publication number
20240128211
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
Publication number
20240128154
Publication date
Apr 18, 2024
FURUKAWA ELECTRIC CO., LTD.
Minoru MORITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
Publication number
20240128209
Publication date
Apr 18, 2024
Newport Fab, LLC dba Tower Semiconductor Newport Beach
Edward Preisler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240120304
Publication date
Apr 11, 2024
Innolux Corporation
Tzu-Sheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
Publication number
20240113063
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Udit RAWAT
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
Publication number
20230411327
Publication date
Dec 21, 2023
KIOXIA Corporation
Masayoshi TAGAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMB...
Publication number
20230386909
Publication date
Nov 30, 2023
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
Publication number
20230384367
Publication date
Nov 30, 2023
QUALCOMM Incorporated
Yangyang SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
Publication number
20230361061
Publication date
Nov 9, 2023
SANDISK TECHNOLOGIES LLC
Shingo TOTANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
Publication number
20230352428
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yen-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
Publication number
20230299026
Publication date
Sep 21, 2023
Magnachip Semiconductor, Ltd.
Myungho PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20230178511
Publication date
Jun 8, 2023
Samsung Electronics Co., Ltd.
Young Chul SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230132056
Publication date
Apr 27, 2023
Mitsubishi Electric Corporation
Shinji SAKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
Publication number
20230114550
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Yongbum KWON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
Publication number
20230077469
Publication date
Mar 16, 2023
Dialog Semiconductor (UK) Limited
Habeeb Mohiuddin Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230016437
Publication date
Jan 19, 2023
DENSO CORPORATION
Yasushi FURUKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
Publication number
20230005979
Publication date
Jan 5, 2023
SONY GROUP CORPORATION
Satoru WAKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
Publication number
20220384204
Publication date
Dec 1, 2022
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
Publication number
20220336396
Publication date
Oct 20, 2022
Skyworks Solutions, Inc.
Jiro YOTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDING STRUCTURES
Publication number
20220328440
Publication date
Oct 13, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
Publication number
20220293558
Publication date
Sep 15, 2022
INFINEON TECHNOLOGIES AG
Roland Rupp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20220285323
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Publication number
20220254746
Publication date
Aug 11, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. ENQUIST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20220102300
Publication date
Mar 31, 2022
LAPIS SEMICONDUCTOR CO., LTD.
Takashi SHIMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
Publication number
20210375759
Publication date
Dec 2, 2021
Samsung Electronics Co., Ltd.
Juik LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
Publication number
20210202417
Publication date
Jul 1, 2021
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
Publication number
20210104462
Publication date
Apr 8, 2021
Samsung Electronics Co., Ltd.
Juik LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20210091023
Publication date
Mar 25, 2021
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Keita Matsuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDING STRUCTURES
Publication number
20210091029
Publication date
Mar 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
Publication number
20200395325
Publication date
Dec 17, 2020
Dialog Semiconductor (UK) Limited
Habeeb Mohiuddin Mohammed
H01 - BASIC ELECTRIC ELEMENTS