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H01L2224/05005

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05005Structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,798,905
- Issue date Oct 24, 2023
- Lapis Semiconductor Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,616,018
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 11,495,567
- Issue date Nov 8, 2022
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,380,639
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,133,253
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting diode array substrate and electronic device
- Patent number 11,063,108
- Issue date Jul 13, 2021
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Liman Peng
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,056,451
- Issue date Jul 6, 2021
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 10,985,114
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure comprising a plurality of metal oxid...
- Patent number 10,943,873
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth memory (HBM) bandwidth aggregation switch
- Patent number 10,916,516
- Issue date Feb 9, 2021
- Xilinx, Inc.
- Martin Newman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,867,944
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 10,861,810
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 10,797,012
- Issue date Oct 6, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy flip chip bumps for reducing stress
- Patent number 10,734,347
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 10,714,457
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240332151
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240304556
- Publication date Sep 12, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Xun XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE
- Publication number 20240250056
- Publication date Jul 25, 2024
- Mohd Afiz Hashim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222236
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PACKAGING THE CHIP
- Publication number 20240213036
- Publication date Jun 27, 2024
- Avary Holding (Shenzhen) Co., Limited.
- ZHI-YONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170421
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Teruhiro KUWAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
- Publication number 20240128211
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient Integration of a First Substrate without Solder Bumps wit...
- Publication number 20240128209
- Publication date Apr 18, 2024
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Edward Preisler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120304
- Publication date Apr 11, 2024
- Innolux Corporation
- Tzu-Sheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS
- Publication number 20240113063
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Udit RAWAT
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230411327
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMB...
- Publication number 20230386909
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
- Publication number 20230361061
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Shingo TOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230178511
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Young Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230132056
- Publication date Apr 27, 2023
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20230077469
- Publication date Mar 16, 2023
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230016437
- Publication date Jan 19, 2023
- DENSO CORPORATION
- Yasushi FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Bonded structures with integrated passive component

Shielding structures

Semiconductor device and package assembly including the same

Conductive barrier direct hybrid bonding

Devices and methods related to stack structures including passivati...

Semiconductor device and method for manufacturing semiconductor device

Power semiconductor chip, method for producing a power semiconducto...

Microelectronic devices and apparatuses having a patterned surface...

Bonded structures with integrated passive component

Semiconductor devices including a thick metal layer

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor device and method of manufacturing thereof

Semiconductor package devices and method for forming semiconductor...

Shielding structures

Semiconductor packages and methods of forming same

Conductive barrier direct hybrid bonding

Stack structures in electronic devices including passivation layers...

Semiconductor devices including a thick metal layer

Organic light emitting diode array substrate and electronic device

Semiconductor device manufacturing method and semiconductor device

Scheme for connector site spacing and resulting structures

Methods of forming microelectronic devices having a patterned surfa...

Semiconductor device structure comprising a plurality of metal oxid...

High bandwidth memory (HBM) bandwidth aggregation switch

Semiconductor structure and manufacturing method thereof

Shielding structures

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Dummy flip chip bumps for reducing stress

Semiconductor packages and methods of forming same

Patents Applicationslast 30 patents

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SILICON CARBIDE SEMICONDUCTOR DEVICE

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING STRUCTURE AND METHOD FOR PACKAGING THE CHIP

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING

THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...

Efficient Integration of a First Substrate without Solder Bumps wit...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

RADIATOR LAYERS FOR ULTRASONIC TRANSDUCERS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMB...

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...