1454997

Information

• Patent Grant
• 1454997

• References
• Source

• Patent Number

  1,454,997

• Date Filed

  Not available

• Date Issued

  Tuesday, May 15, 1923
  102 years ago

• CPC

  • H01L24/33 - of a plurality of layer connectors
  • H01L23/10 - characterised by the material or arrangement of seals between parts,ween cap
  • H01L23/14 - characterised by the material or its electrical properties
  • H01L23/32 - Holders for supporting the complete device in operation
  • H01L24/83 - using a layer connector
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L24/48 - of an individual wire connector
  • H01L2224/48137 - the bodies being arranged next to each other
  • H01L2224/4823 - connecting the wire to a pin of the item
  • H01L2224/8319 - Arrangement of the layer connectors prior to mounting
  • H01L2224/8385 - using a polymer adhesive
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/014 - Solder alloys
  • H01L2924/07802 - not being an ohmic electrical conductor
  • H01L2924/12037 - Cat's whisker diode
  • H01L2924/15312 - being a pin array
  • H01L2924/16152 - Cap comprising a cavity for hosting the device

• US Classifications

  • 257 - Active solid-state devices