3025978

Information

• Patent Grant
• 3025978

• References
• Source

• Patent Number

  3,025,978

• Date Filed

  Not available

• Date Issued

  Tuesday, March 20, 1962
  62 years ago

• CPC

  • H01L21/67126 - Apparatus for sealing, encapsulating, glassing, decapsulating or the like
  • H01J5/20 - Seals between parts of vessels
  • H01J5/26 - between insulating and conductive parts of vessel
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67121 - Apparatus for making assemblies not otherwise provided for
  • H01L23/041 - the container being a hollow construction having no base used as a mounting for the semiconductor body
  • H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H05K13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H01J2893/0037 - Solid sealing members other than lamp bases
  • H01J2893/0043 - Glass-to-metal or quartz-to-metal
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/0102 - Calcium [Ca]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01043 - Technetium [Tc]
  • H01L2924/01068 - Erbium [Er]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H01L2924/12033 - Gunn diode
  • Y10T74/18888 - Reciprocating to or from oscillating

• US Classifications

  • 414 - Material or article handling
  • 074 - Machine element or mechanism
  • 257 - Active solid-state devices