3391426

Information

• Patent Grant
• 3391426

• References
• Source

• Patent Number

  3,391,426

• Date Filed

  Not available

• Date Issued

  Tuesday, July 9, 1968
  56 years ago

• CPC

  • B29C45/14655 - connected to or mounted on a carrier
  • H01L21/565 - Moulds
  • H01L23/49562 - for devices being provided for in H01L29/00
  • H01L24/48 - of an individual wire connector
  • H01L24/49 - of a plurality of wire connectors
  • H01L2224/48091 - Arched
  • H01L2224/48247 - connecting the wire to a bond pad of the item
  • H01L2224/49171 - Fan-out arrangements
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/14 - Integrated circuits
  • Y10S425/035 - Opposed plunger
  • Y10T29/49121 - Beam lead frame or beam lead device
  • Y10T29/49163 - with sintering of base
  • Y10T29/4998 - Combined manufacture including applying or shaping of fluent material
  • Y10T428/12188 - having marginal feature for indexing or weakened portion for severing
  • Y10T428/12528 - Semiconductor component

• US Classifications

  • 425 - Plastic article or earthenware shaping or treating: apparatus
  • 029 - Metal working
  • 249 - Static molds
  • 257 - Active solid-state devices
  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 438 - Semiconductor device manufacturing: process