3412456

Information

• Patent Grant
• 3412456

• References
• Source

• Patent Number

  3,412,456

• Date Filed

  Not available

• Date Issued

  Tuesday, November 26, 1968
  56 years ago

• CPC

  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • F16D33/14 - consisting of shiftable or adjustable scoops
  • H01L21/0272 - for lift-off processes
  • H01L23/485 - consisting of layered constructions comprising conductive layers and insulating layers
  • H01L24/05 - of an individual bonding area
  • H01L24/85 - using a wire connector
  • H01L24/48 - of an individual wire connector
  • H01L2224/04042 - Bonding areas specifically adapted for wire connectors
  • H01L2224/05556 - in side view
  • H01L2224/05624 - Aluminium [Al] as principal constituent
  • H01L2224/45015 - being circular
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/4847 - the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/85 - using a wire connector
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01322 - Eutectic Alloys
  • Y10S228/903 - Metal to nonmetal
  • Y10S438/951 - Lift-off

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 430 - Radiation imagery chemistry: process, composition, or product thereof