3639975

Information

• Patent Grant
• 3639975

• References
• Source

• Patent Number

  3,639,975

• Date Filed

  Not available

• Date Issued

  Tuesday, February 8, 1972
  52 years ago

• CPC

  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • H01L23/291 - Oxides or nitrides or carbides
  • H01L23/3157 - Partial encapsulation or coating
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01018 - Argon [Ar]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/0103 - Zinc [Zn]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01051 - Antimony [Sb]
  • H01L2924/01058 - Cerium [Ce]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01084 - Polonium [Po]
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/10253 - Silicon [Si]
  • H01L2924/3025 - Electromagnetic shielding
  • H01L2924/351 - Thermal stress
  • Y10S65/11 - Encapsulating

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 065 - Glass manufacturing
  • 257 - Active solid-state devices