Claims
- 1. A manufacturing method of a heat conductive molded body, wherein a magnetic field is applied to a high polymer composition containing a diamagnetic filler having a thermal conductivity of 20 W/m° K or more, and the diamagnetic filler contained in the composition being orientated in a fixed direction by application of the magnetic field and hardened in the fixed direction and the diamagnetic filler is graphite having a thermal conductivity of 200 W/m° K or more at least in one direction.
- 2. The manufacturing method of the heat conductive molded body of claim 1, wherein the high polymer is selected from the group consisting of silicone rubber, epoxy resin and polymide resin.
- 3. The manufacturing method of the heat conductive molded body of claim 1, wherein the concentration of diamagnetic filler in the heat conductive molded body is 5-80% in volume.
- 4. The manufacturing method of the heat conductive molded body of claim 3, wherein the high polymer is selected from the group consisting of silicone rubber, epoxy resin and polymide resin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-87483 |
Mar 1999 |
JP |
|
Parent Case Info
This application is a divisional of application Ser. No 09/534,938, filed Mar. 24, 2000 now pending.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4838347 |
Dentini et al. |
Jun 1989 |
A |
4996115 |
Eerkes et al. |
Feb 1991 |
A |