Number | Date | Country | Kind |
---|---|---|---|
9-078171 | Mar 1997 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
5396403 | Patel | Mar 1995 | |
5523260 | Missele | Jun 1996 | |
5585671 | Nagesh et al. | Dec 1996 | |
5744863 | Culnane et al. | Apr 1998 | |
5751062 | Daikaku et al. | May 1998 |
Number | Date | Country |
---|---|---|
0 630 176 A1 | Dec 1994 | EPX |
0 661 739 A2 | Jul 1995 | EPX |
0 709 883 A1 | May 1996 | EPX |
37 16 196 A1 | Mar 1988 | DEX |
5-82686 | Apr 1993 | JPX |
7-58253 | Mar 1995 | JPX |
7-321258 | Dec 1995 | JPX |
Entry |
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Japanese Office Action datedOct. 20, 1998, with partial translation. |
"Thermal Compound for Semiconductor Packages", by E. R. Mondou and S. P.Young, IBM Technical Disclosure Bulletin, vol. 25 No. 7B, Dec. 1982, pp. 4035-4036. |
"Parts and Packaging Technologies for GS8600 and GS8400" by Y. Morita et al., FUJITSU. 47.2., Mar. 1996, pp. 132-138. |