Low profile managed memory component

Abstract

A system and method for combining at least two semiconductor die using multi-layer flex circuitry is provided. A first semiconductor die is attached and preferably electrically connected to a first layer of the flex circuitry while a second semiconductor die is set, at least in part, into a window that extends into the flex circuitry to expose a layer of the flex to which the second die is attached. When the second semiconductor die is a flip-chip device, it is connected through its contacts to the layer of flex exposed in the window and when it is a die with its contact side oriented away from the flex circuitry, it is preferably electrically connected with wire bonds to another conductive layer of the flex circuitry. In preferred modules, the first semiconductor die is preferably a flash memory circuit and the second semiconductor die is preferably a controller.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an exemplar module devised in accordance with a preferred embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of the approximate area marked “A” in FIG. 1.

FIG. 3 is an enlarged cross-sectional view of an exemplar flex circuitry in accordance with a preferred embodiment of the present invention.

FIG. 4 depicts a cross-sectional view of an alternative embodiment in accordance with the present invention.

FIG. 5 is an enlarged cross-sectional depiction of an embodiment in which two semiconductor die are flip-chip devices with contact faces disposed in opposite directions and toward each other.

FIG. 6 illustrates an embodiment in accordance with the present invention in which one semiconductor die is a flip-chip device and a second semiconductor die is connected to the flex circuitry with wire bonds and the respective contact faces of the die are oriented in the same direction.

Claims

1. A flash memory circuit module comprising: flex circuitry having first and second sides and a window extending partially through the flex circuitry, the flex circuitry having at least a first conductive layer and plural secondary conductive layers;a first flash memory semiconductor die attached and electrically connected to the first conductive layer of the flex circuitry;a second semiconductor die that is a controller, the second semiconductor die being disposed at least in part into the window and attached to a selected first one of the plural secondary conductive layers; andplural module contacts.

2. The flash memory circuit module of claim 1 in which the second semiconductor die is electrically connected to the selected first one of the plural secondary conductive layers.

3. The flash memory circuit module of claim 1 in which the second semiconductor die is electrically connected to a selected second one of the plural secondary conductive layers.

4. The flash memory circuit module of claim 1 in which both the first and the second semiconductor die are surrounded by encapsulate.

5. The flash memory circuit module of claim 3 in which the second semiconductor die is electrically connected to the selected second one of the plural secondary conductive layers with wire bonds.

6. The flash memory circuit module of claim 2 in which the second semiconductor die is a flip-chip device.

7. The flash memory circuit module of claim 1 in which the flex circuitry has three secondary conductive layers and more than one intermediate layer.

8. The flash memory circuit module of claim 3 in which the first semiconductor die is a flip-chip device.

9. The flash memory circuit module of claim 2 in which the first semiconductor die is electrically connected with wire bonds to the first conductive layer of the flex circuitry.

10. The flash memory circuit module of claim 1 in which one of the first or the second semiconductor die is attached to the flex circuitry with die attach.

11. The flash memory circuit module of claim 1 in which the first and second semiconductor die are electrically connected to the flex circuitry with wire bonds.

12. The flash memory circuit module of claim 1 in which a selected one of the plural secondary conductive layers is exposed through the window and the second semiconductor die is attached to the selected one of the plural secondary conductive layers.

13. A circuit module comprising: flex circuitry having at least first, second, and third layers, at least the first and third layers being conductive, the flex circuitry having a window that projects into the flex circuitry and through which window at least a portion of the second layer is exposed;a first semiconductor die which has a contact face and said first semiconductor die is attached and electrically connected to the first conductive layer and a second semiconductor die which has a contact face and which second semiconductor die is inserted at least in part into the window of the flex circuitry and attached to the second layer; anda set of module contacts.

14. The circuit module of claim 13 in which the first semiconductor die is a flash memory circuit and the second semiconductor die is a controller.

15. The circuit module of claim 13 in which the first semiconductor die is a controller and the second semiconductor die is a flash memory circuit.

16. The circuit module of claim 13 in which the first and second semiconductor die are disposed so as to orient their respective contact faces in opposite directions with respect to each other.

17. The circuit module of claim 16 in which the respective contact faces of the first and second semiconductor die face away from the flex circuitry.

18. The circuit module of claim 16 in which the respective contact faces of the first and second semiconductor die face toward each other.

19. The circuit module of claim 13 in which the respective contact faces of the first and second semiconductor die face in the same direction.

20. The circuit module of claim 13 in which the first and second semiconductor die are electrically connected with wire bonds to the first and third layers of the flex circuitry, respectively.

21. The circuit module of claim 13 in which the second layer of the flex circuitry is conductive and the first and second semiconductor die are flip-chip devices and the second semiconductor die is electrically connected to the second layer.

22. The circuit module of claim 13 in which the first and second die are in encapsulate.

23. The circuit module of claim 13 in which the window extends through at least the third conductive layer but not the second conductive layer of the flex circuitry.

24. The circuit module of claim 13 in which adhesive is disposed between at least the first and second layers of the flex circuitry.

25. The circuit module of claim 13 in which the first and second semiconductor die are electrically connected to the flex circuitry with wire bonds.

26. The circuit module of claim 25 in which encapsulate covers the wire bonds.

27. A circuit module comprising: flex circuitry having first and second sides, the flex circuitry comprising multiple layers including at least first and second conductive layers and the flex circuitry having a window that projects into the flex circuitry;a flash memory semiconductor die attached and electrically connected to the first conductive layer; anda second semiconductor die inserted at least in part into the window and attached to and electrically connected to the second conductive layer of the flex circuitry.

28. The circuit module of claim 27 in which the flash memory semiconductor die is electrically connected to one of the first conductive layer of the flex circuitry with wire bonds.

29. The circuit module of claim 28 in which encapsulate covers the wire bonds.

30. The circuit module of claim 27 in which the second semiconductor die is a controller.