This application is a continuation of prior application Ser. No. 07/361,900, filed Jun. 5, 1989, now abandoned.
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4566026 | Lee et al. | Jan 1986 | |
4782032 | Geissberger et al. | Nov 1988 | |
4782380 | Shankar et al. | Nov 1988 | |
4787958 | Lytle | Nov 1988 | |
4927505 | Sharma et al. | May 1990 |
Entry |
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Meyer, Mettallurgy of TiW/Au/Cu System for TAB Assembly, J. Vac. Sci. Technol., Jun., 1985, pp. 772-776. |
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Wolf, S., Silicon Processing for the VLSI Era, vol. 1, Process Technology, pp. 367 and 372, Lattice Press, 1986. |
Vossen, Jr. Preparation of Surfaces for high quality interface formation, J. Vac. Sci. Tech., A2(2), Jun. 1984, pp. 212-215. |
Number | Date | Country | |
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Parent | 361900 | Jun 1989 |