Claims
- 1. A dry-etching method comprising the steps of:
- forming a carbon film on a substrate to be etched;
- forming a resist pattern on said carbon thin film;
- selectively etching said carbon film using said resist pattern as a mask by a plasma of a gas mixture of a gas containing fluorine atoms and a gas containing oxygen atoms which are mixed at an atomic ratio of fluorine to oxygen of 198:1 to 1:2 so as to form a carbon film pattern; and
- selectively etching said substrate to be etched using said carbon film pattern as a mask or said resist pattern and said carbon film pattern as masks.
- 2. A method according to claim 1, wherein the gas containing fluorine atoms is at least one selected from the group consisting of CF.sub.4, CHF.sub.3 SF.sub.6, NF.sub.3, C.sub.2 F.sub.6, C.sub.3 F.sub.8, BF.sub.3, XeF.sub.2, and F.sub.2.
- 3. A method according to claim 1, wherein the gas containing oxygen atoms is at least one selected from the group consisting of O.sub.2, O.sub.3, and CO.
- 4. A method according to claim 1, wherein the gas containing fluorine atoms is CF.sub.4, the gas containing oxygen atoms is O.sub.2 and a ratio of CF.sub.4 to O.sub.2 is 3:7 to 99:1.
- 5. A method according to claim 1, wherein the gas containing fluorine atoms is CHF.sub.3, the gas containing oxygen atoms is O.sub.2 and a ratio of CHF.sub.3 to O.sub.2 is 9:1 to 25:75.
- 6. A method according to claim 1, wherein said substrate to be etched is at least one selected from the group consisting of an AlSiCu alloy film, an SiO.sub.2 film, SiN film, polycrystalline silicon film, W film, Cu film, TiN film, Ti film, Ta.sub.2 O.sub.5 film, Nb.sub.2 O.sub.5 film, SrTiO.sub.3 film and BaTiO.sub.3 film.
- 7. A method according to claim 1, further comprising the steps of: heating said carbon film pattern; and removing said carbon film pattern by oxygen radicals.
- 8. A method according to claim 7, wherein said carbon film pattern is heated to a temperature of 100.degree. to 500.degree. C.
- 9. A method according to claim 7, wherein said carbon film pattern is heated to a temperature of 100.degree. to 300.degree. C.
- 10. A method according to claim 7, wherein the oxygen radicals are formed by applying a high-frequency wave to a gas containing oxygen atoms.
- 11. A method according to claim 10, wherein the gas containing oxygen atoms is at least one selected from the group consisting of O.sub.2 O.sub.3, and CO.
- 12. A method according to claim 10, wherein the gas containing oxygen atoms is a gas mixture of O.sub.2 and at least one selected from the group consisting of CF.sub.4, CHF.sub.3 SF.sub.6, NF.sub.3, CF.sub.4, C.sub.2 F.sub.6, C.sub.3 F.sub.8, BF.sub.3, XeF.sub.2, and F.sub.2.
- 13. A dry-etching method comprising the steps of:
- forming a carbon film on a substrate to be etched;
- forming a resist pattern on said carbon thin film;
- selectively etching said carbon film using said resist pattern as a mask to form a carbon film pattern.,
- selectively etching said substrate to be etched using said carbon film pattern as a mask or said resist pattern and said carbon film pattern as masks;
- heating said carbon film pattern; and
- removing said carbon film pattern by oxygen radicals.
- 14. A method according to claim 13, wherein said carbon film pattern is heated to a temperature of 100.degree. to 500.degree. C.
- 15. A method according to claim 13, wherein said carbon film pattern is heated to a temperature of 100.degree. to 300.degree. C.
- 16. A method according to claim 13, wherein the oxygen radicals are formed by applying a high-frequency wave to a gas containing oxygen atoms.
- 17. A method according to claim 16, wherein the gas containing oxygen atoms is at least one selected from the group consisting of O.sub.2 O.sub.3, and CO.
- 18. A method according to claim 16, wherein the gas containing oxygen atoms is a gas mixture of O.sub.2 and at least one selected from the group consisting of CF.sub.4, CHF.sub.3 SF.sub.6, NF.sub.3, CF.sub.4, C.sub.2 F.sub.6, C.sub.3 F.sub.8, BF.sub.3, XeF.sub.2, and F.sub.2.
- 19. A method according to claim 13, further comprising the step of removing said resist pattern after the step of forming said carbon film pattern or the step selectively etching said substrate to be etched.
- 20. A method according to claim 13, wherein said resist pattern is removed simultaneously with said carbon film pattern in the step of removing said carbon film pattern.
- 21. A method according to claim 13, wherein after said substrate to be etched is selectively etched, said resist pattern is removed by the oxygen radicals, and said carbon film pattern is heated to remove said carbon film pattern by the oxygen radicals.
- 22. A method according to claim 13, wherein after said substrate to be etched is selectively etched, said resist pattern is removed by the oxygen radicals at a first position, and said carbon film pattern is heated at a second position to remove said carbon film pattern by the oxygen radicals.
Priority Claims (6)
Number |
Date |
Country |
Kind |
3-21569 |
Jan 1991 |
JPX |
|
3-211302 |
Jul 1991 |
JPX |
|
4-4197 |
Jan 1992 |
JPX |
|
4-4198 |
Jan 1992 |
JPX |
|
4-032060 |
Feb 1992 |
JPX |
|
4-191076 |
Jul 1992 |
JPX |
|
CROSS-REFERENCES TO THE RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 824,095, filed on Jan. 22, 1992.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5022959 |
Itoh |
Jun 1991 |
|
5240554 |
Hori et al. |
Aug 1993 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
824095 |
Jan 1992 |
|