Claims
- 1. A method for producing a lead frame for semiconductor device packages, comprising:providing particles for mechanically impacting one or more surfaces of a lead frame material to produce a modified material having an uneven surface; controlling formation of said dimples within desired ranges of at least one of size number and shape by adjusting at least one of a size of said particles, a concentration of said particles a speed of said lead frame material through said providing, and a pressure of said providing, while within these desired ranges, the dimples are randomly and irregularly formed; leveling said modified material to produce a leveled modified material; and stamping said leveled modified material to produce said lead frame.
- 2. The method according to claim 1, further comprising:prior to said step of modifying, preparing a lead frame material in a form of a reel of thin tape or a coil; and uncoiling said lead frame material using an uncoiling means.
- 3. The method according to claim 2, said step of modifying comprising:introducing said lead frame material into a surface modification apparatus having injection means disposed above and below a path of said lead frame material; injecting compressed air containing particle media onto said lead frame material forming dimples thereon to produce a dimpled material; and ejecting said dimpled material from said apparatus to produce said modified material.
- 4. The method according to claim 3, wherein during said injecting step, a concentration of said particle media contained in said compressed air is in a range of from about 100 g/l to about 200 g/l.
- 5. The method according to claim 4, wherein during said injecting step, said particle media has an average particle diameter of from about 10 to about 200 μm.
- 6. The method according to claim 5, wherein during said injecting step, said compressed air is injected at a pressure of from about 1.2 kg/cm2 to about 4.5 kg/cm.
- 7. The method according to claim 1, wherein said providing particles includes injecting compressed air containing said particles onto said lead frame material forming dimples thereon to produce a dimpled material.
- 8. The method according to claim 1, wherein said particles are one of plastic resins, silicone resins, glass, and nutshell scraps.
- 9. The method according to claim 1, wherein said particles have different shapes.
Priority Claims (1)
Number |
Date |
Country |
Kind |
97-12453 |
Apr 1997 |
KR |
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CROSS REFERENCE TO RELATED APPLICATIONS
This is a divisional application of application Ser. No. 09/045,375 filed Mar. 20, 1998, which is hereby incorporated by reference in its entirely.
US Referenced Citations (11)
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JP |
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KR |