MOSFET power package

Abstract

A power MOSFET package is disclosed. The power MOSFET package includes a leadframe having first and second die pads insulated one from the other, the first die pad being coupled to a first drain lead and the second die pad being coupled to a second drain lead. A first MOSFET device has a drain contact coupled-to the first die pad, a gate contact coupled to a first gate lead, and a source contact coupled to the second die pad. A second MOSFET device has a drain contact coupled to the second die pad, a gate contact coupled to a second gate lead, and a source contact coupled to a source lead. An encapsulant substantially encapsulates the leadframe, the first and second MOSFET devices and portions of the first and second gate leads, the first and second drain leads, and the source lead.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic representation of a prior art TO-252 package leadframe;

FIG. 1A is a top view of a TO-252 package of the prior art;

FIG. 2 is a circuit diagram of a synchronous buck converter;

FIG. 3 is a PCB layout of a prior art synchronous buck converter;

FIG. 4 is a PCB layout of a synchronous buck converter in accordance with the invention;

FIG. 5 is a schematic representation of a TO-252 package leadframe in accordance with the invention; and

FIG. 5A is a top view of a TO-252 package in accordance with the invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides a TO-252 power MOSFET package for use in implementing a synchronous buck converter. With reference to FIG. 5, a TO-252 package leadframe 500 includes a pair of drain pads 510 and 520 having disposed thereon MOSFETs 515 and 525 respectively. Drain pads 510 and 520 are insulated from each other after a connecting portion 505 is trimmed off along dashed line A-A at the end of the packaging process. MOSFETs 515 and 520 are preferably soldered to drain pads 510 and 520 respectively or, alternatively, attached using conductive epoxy.

Wire bonding 530 connects the source of MOSFET 515 to the drain pad 520. A gate of MOSFET 515 is wire bonded to gate lead G1 by wire bond 517, a gate of MOSFET 525 is wire bonded to gate lead G2 by wire bond 527, and a source of MOSFET 525 is wire bonded to source lead S2 by wire bonding 540. A lead D1 is coupled to drain pad 510 while a lead D2/S1 is coupled to drain pad 520.

A TO-252 package 550 in accordance with the invention is shown in FIG. 5A and includes headers 560 and a plastic molding 570. In use, and as shown in FIG. 4, the package 550 may be used to implement a synchronous buck converter 400. The synchronous buck converter 400 using the package 550 uses less PCB space in comparison to the conventional PCB layout shown in FIG. 3. The package 550 advantageously provides an optimized lead layout. Including a 5-lead TO-252 package configuration.

It should be understood, of course, that the foregoing relates to preferred embodiments of the invention and that modifications may be made without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. A power MOSFET package comprising: a leadframe having first and second die pads insulated one from the other, the first die pad being coupled to a first drain lead and the second die pad being coupled to a second drain lead;a first MOSFET device having a drain contact coupled to the first die pad, a gate contact coupled to a first gate lead, and a source contact coupled to the second die pad;a second MOSFET device having a drain contact coupled to the second die pad, a gate contact coupled to a second gate lead, and a source contact coupled to a source lead; andan encapsulant substantially encapsulating the leadframe, the first and second MOSFET devices and portions of the first and second gate leads, the first and second drain leads, and the source lead.

2. The power MOSFET package of claim 1, wherein the package is a TO-252 package.

3. The power MOSFET package of claim 1, wherein the package is operable to provide power and synchronous switching to a synchronous buck converter circuit.

4. A power MOSFET package for providing power and synchronous switching to a synchronous buck converter circuit comprising: a leadframe having first and second die pads insulated one from the other, the first die pad being coupled to a first drain lead and the second die pad being coupled to a second drain lead;a first MOSFET device having a drain contact coupled to the first die pad, a gate contact coupled to a first gate lead, and a source contact coupled to the second die pad;a second MOSFET device having a drain contact coupled to the second die pad, a gate contact coupled to a second gate lead, and a source contact coupled to a source lead; andan encapsulant substantially encapsulating the leadframe, the first and second MOSFET devices and portions of the first and second gate leads, the first and second drain leads, and the source lead.

5. The power MOSFET package of claim 4, wherein the package is a TO-252 package.