Claims
- 1. A multilayer circuit board comprising;
- an external surface comprising a dielectric material;
- a plurality of through-holes having capped external openings in said external surface;
- a plurality of pads coupled to said openings so that said pads cap said openings, said pads comprising a top flat surface distal from its associated through-hole of said plurality of through-holes and said top surface is positioned approximately flush with said external surface.
- 2. The multilayer circuit board of claim 1 wherein at least one of said pads comprises a disk shape for covering its associated through-hole of said plurality of through-holes.
- 3. The multilayer circuit board of claim 1 wherein at least one of said plurality of pads comprises a shape for covering at least two of said through-holes.
- 4. The multilayer circuit board of claim 3 wherein said at least one pad of said plurality of pads comprises a joining metal that couples each pad to its associated through-hole.
- 5. The multilayer circuit board of claim 4 wherein said joining metal comprises a gold-tin alloy.
Parent Case Info
This is a division of application Ser. No. 08/580,678 filed on Dec. 29, 1995 now U.S. Pat. No. 5,829,124.
US Referenced Citations (26)
Divisions (1)
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Number |
Date |
Country |
Parent |
580678 |
Dec 1995 |
|