Optical device and method for manufacturing the same

Abstract

An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating an image pickup device of a first embodiment.

FIG. 2A is a plan view illustrating the image pickup device of the first embodiment.

FIG. 2B is a sectional view taken along the line IIB-IIB shown in FIG. 2A.

FIG. 3 is an enlarged sectional view illustrating a major part of the image pickup device of the first embodiment.

FIG. 4 is an enlarged sectional view illustrating an image pickup region of an image pickup element of the first embodiment.

FIG. 5 is an enlarged sectional view illustrating a major part of a first comparative image pickup device to the first embodiment.

FIG. 6 is an enlarged sectional view illustrating a major part of a second comparative image pickup device to the first embodiment.

FIGS. 7A to 7C are sectional views illustrating some steps of a method for manufacturing the image pickup device of the first embodiment.

FIGS. 8A to 8C are sectional views illustrating the other steps of the method for manufacturing the image pickup device of the first embodiment.

FIG. 9 is a sectional view illustrating some steps of a method for manufacturing an image pickup device of a second embodiment.

FIG. 10 is a sectional view illustrating the structure of an image pickup device of a third embodiment.

FIG. 11 is a sectional view illustrating the structure of an image pickup device of a fourth embodiment.

Claims

1. An optical device comprising: a substrate;an optical element mounted on one of the surfaces of the substrate to receive or emit light;a plate-shaped translucent component whose bottom surface is bonded to a top surface of the optical element;a plurality of terminals provided on the periphery of said one of the surfaces of the substrate and electrically connected to the optical element; anda sealant provided on said one of the surfaces of the substrate to seal the optical element therein, whereinthe sealant is located lower than a top surface of the translucent component anda top surface of the translucent component is exposed out of the sealant a side surface of the translucent component is covered with the sealant.

2. The optical device of claim 1, wherein a recess is formed in a top surface of part of the sealant to surround the translucent component.

3. The optical device of claim 1, wherein a recess is formed in a top surface of part of the sealant to surround the translucent component,the sealant covers all the side surface of the translucent component anda distance between the top surface of the sealant and the substrate becomes smaller in part of the sealant at a larger distance from the recess surrounding the translucent component.

4. The optical device of claim 1, wherein the top surface of the sealant has arithmetic average roughness smaller than that of the side surface of the sealant.

5. The optical device of claim 1, wherein the translucent component is bonded to the optical element with a translucent adhesive.

6. The optical device of claim 1, wherein the entire bottom surface of the translucent component is bonded to the top surface of the optical element.

7. The optical device of claim 5, wherein the optical element is an image pickup element for converting received light into an electrical signal,lenses are provided on the top surface of the image pickup element to gather light into the image pickup element andthe lenses have a refractive index higher than that of the translucent adhesive.

8. The optical device of claim 1 further comprising: a plurality of conductive parts penetrating the substrate in the thickness direction; anda plurality of second terminals electrically connected to the plurality of terminals, respectively, whereinthe plurality of terminals are configured to extend from the conductive parts to said one of the surfaces of the substrate and electrically connected to the optical element via a plurality of thin conductive wires andthe plurality of second terminals are configured to extend from the conductive parts to the other surface of the substrate.

9. A method for manufacturing an optical device including an optical element for receiving or emitting light, the method comprising the steps of: (a) providing a plurality of terminals on the periphery of one of the surfaces of a substrate;(b) fixing the optical element onto said one of the surfaces of the substrate;(c) bonding a bottom surface of a plate-shaped translucent component to a top surface of the optical element;(d) electrically connecting the plurality of terminals and the optical element to provide a first intermediate structure;(e) laying a sealing film extending substantially parallel to the substrate on a top surface of the translucent component;(f) injecting resin between the sealing film laid on the translucent component and the substrate to seal the optical element therein; and(g) removing the sealing film from the translucent component after the step (f).

10. The method of claim 9, wherein the step (e) includes the steps of: laying the sealing film on the translucent component of the first intermediate structure to provide a second intermediate structure; andplacing the second intermediate structure in a cavity in a pair of molding dies and bringing the sealing film of the second intermediate structure into contact with an inner surface of the cavity.

11. The method of claim 9, wherein the step (e) includes the steps of: attaching the sealing film onto an inner surface of a cavity in a pair of molding dies; andplacing the first intermediate structure in the cavity and bringing the sealing film attached to the inner surface of the cavity into contact with the translucent component of the first intermediate structure, while the sealing film is kept substantially parallel to the substrate of the first intermediate structure.

12. The method of claim 9, wherein a mother board provided with a plurality of regions defined on one of the surfaces thereof is used as the substrate and the plurality of terminals are provided in each region in the step (a),the optical element is fixed to said one of the surfaces of the mother board in each region in the step (b),a bottom surface of the translucent component is bonded to a top surface of the optical element in each region in the step (c); andthe step (g) is followed by the step of dividing the mother board by the regions to obtain a plurality of optical devices from the single mother board.