Claims
- 1. An apparatus, comprising:
a substrate; an electrical device configured to be mounted to the substrate by solder joints; and a reflow encapsulant, comprising:
inorganic filler material provided in an amount of 8% to 20% of the encapsulant by weight for providing structural support to the connection between the substrate and the electronic device, the reflow encapsulant being configured to cure while the solder joints are reflowed.
- 2. The apparatus of claim 1 in which the inorganic filler material is provided in an amount of 15% by weight of the encapsulant.
- 3. The apparatus of claim 1 in which the encapsulant comprises an epoxy resin.
- 4. The apparatus of claim 1 in which the inorganic filler material comprises alumina.
- 5. The apparatus of claim 1 in which the inorganic filler material comprises spherical particles.
- 6. A reflow encapsulant comprising:
a curable adhesive; a fluxing system; and inorganic filler material provided in an amount of 8-20% by weight of the reflow encapsulant.
- 7. The reflow encapsulant of claim 6 in which the inorganic filler material is provided in an amount of 15% by weight of the encapsulant.
- 8. The reflow encapsulant of claim 6 in which the adhesive comprises an epoxy resin.
- 9. The reflow encapsulant of claim 6, in which the inorganic filler material comprises alumina.
- 10. The reflow encapsulant of claim 6, in which the inorganic filler material comprises spherical particles.
- 11. An apparatus comprising the reflow encapsulant of claim 6, and further comprising:
a substrate; and an electronic device connected to the substrate, the reflow encapsulant being located between the substrate and the electronic device so as to provide structural support to the connection between the substrate and the electronic device.
- 12. An apparatus, comprising:
a substrate including electrical conduits; an electronic device having electrical contacts configured to be connected to the electrical conduits; and means for structurally reinforcing the connection between the substrate and the electronic device.
- 13. The apparatus of claim 12 in which the apparatus is a disc drive.
- 14. The apparatus of claim 12 in which the substrate is a printed circuit cable.
- 15. The apparatus of claim 12 in which the electronic device is a flip chip.
- 16. The apparatus of claim 12 including solder balls for connecting the electrical contacts to the electrical conduits.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 60/218,029, filed Jul. 12, 2000.
Provisional Applications (1)
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Number |
Date |
Country |
|
60218029 |
Jul 2000 |
US |