Claims
- 1. An apparatus, comprising:a substrate; an electrical device configured to be mounted to the substrate by solder joints; and a reflow encapsulant, comprising: inorganic filler material provided in an amount of 8% to 20% of the encapsulant by weight for providing structural support to the connection between the substrate and the electronic device, the reflow encapsulant being configured to cure while the solder joints are reflowed.
- 2. The apparatus of claim 1 in which the inorganic filler material is provided in an amount of about 15% by weight of the encapsulant.
- 3. The apparatus of claim 1 in which the encapsulant comprises an epoxy resin.
- 4. The apparatus of claim 1 in which the inorganic filler material comprises alumina.
- 5. The apparatus of claim 1 in which the inorganic filler material comprises spherical particles.
- 6. An apparatus comprising:a substrate including electrical conduits; an electronic device having electrical contacts configured to be connected to the electrical conduits; and a reflow encapsulant for structurally reinforcing the connection between the substrate and the electronic device, comprising: a curable adhesive; a fluxing system; and inorganic filler material provided in an amount of 8-20% by weight of the reflow encapsulant.
- 7. The apparatus of claim 6 in which the inorganic filler material is provided in an amount of about 15% by weight of the encapsulant.
- 8. The apparatus of claim 6 in which the adhesive comprises an epoxy resin.
- 9. The apparatus of claim 6, in which the inorganic filler material comprises alumina.
- 10. The apparatus of claim 6, in which the inorganic filler material comprises spherical particles.
CROSS REFERENCE TO RELATED APPLICATIONS
This application claims the benefit of U.S. Provisional Application No. 60/218,029, filed Jul. 12, 2000.
US Referenced Citations (15)
Provisional Applications (1)
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Number |
Date |
Country |
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60/218029 |
Jul 2000 |
US |