Resin composition for semiconductor encapsulation and semiconductor device

Abstract

An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which exhibit high flame resistance, and high soldering resistance after humidified, and has an advantage of low material and production costs.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, advantages and features of the present invention will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional view of a semiconductor device using an epoxy resin composition according to an embodiment of the present invention.

Claims

1. A resin composition for semiconductor encapsulation, comprising: (A) an epoxy resin;(B) a phenolic compound containing two or more phenolic hydroxyl groups;(C) an inorganic filler; and(D) a curing accelerator;wherein the epoxy resin (A) comprises an epoxy resin (a1) represented by the formula (1), and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H. for 168 hours:

2. The resin composition as set forth in claim 1, wherein the epoxy resin (a1) is a glycidyl-etherification product of a phenol resin with epichlorohydrin, the phenol resin being a co-condensation product of a phenol, an aldehyde, and a compound (G) represented by the formula (2):

3. The resin composition as set forth in claim 1, wherein the epoxy resin (a1) is represented by the formula (3):

4. The resin composition as set forth in claim 3, wherein the epoxy resin is represented by the formula (4):

5. The resin composition as set forth in claim 1, wherein the phenolic compound (B) is represented by the formula (5):

6. The resin composition as set forth in claim 1, wherein the curing accelerator (D) is at least one compound selected from the group consisting of a compound represented by the formula (6), a compound represented by the formula (7), a compound represented by the formula (8), and a compound represented by the formula (9):

7. The resin composition as set forth in claim 1, further comprising: (E) a silane coupling agent; and(F) an aromatic compound having at least two hydroxyl groups combined with each of adjacent carbon atoms comprising the aromatic ring.

8. The resin composition as set forth in claim 7, wherein the aromatic compound (F) has two hydroxyl groups combined with each of adjacent carbon atoms comprising the aromatic ring.

9. The resin composition as set forth in claim 7, wherein the aromatic compound (F) has a naphthalene ring and at least two hydroxyl groups combined with each of adjacent carbon atoms comprising the naphthalene ring.

10. The resin composition as set forth in claim 7, wherein the aromatic compound (F) has a naphthalene ring and two hydroxyl groups combined with each of adjacent carbon atoms comprising the naphthalene ring.

11. The resin composition as set forth in claim 7, wherein the resin composition contains the compound (F) in an amount of 0.01 weight % or more to 1 weight % or less to the total weight of the resin composition.

12. The resin composition as set forth in claim 7, wherein the resin composition contains the silane coupling agent (E) in an amount of 0.01 weight % or more to 1 weight % or less to the total weight of the resin composition.

13. The resin composition as set forth in claim 7, wherein the resin composition contains the inorganic filler (C) in an amount of 80 weight % or more to 92 weight % or less to the total weight of the resin composition.

14. A semiconductor device comprising: a semiconductor element encapsulated by the cured resin of resin composition as set forth in claim 1.