The present invention relates to a semiconductor device having a through silicon via and a method for manufacturing the semiconductor device.
Recently, a through silicon via has been used in a mounting technique of a semiconductor device.
For example, JP 2007-520051 A (PTL 1) describes a conductive via
JP 2007-012854 A (PTL 2) describes a semiconductor chip including a first wiring pattern and a second wiring pattern that electrically couples a through via and an external connecting terminal. CITATION LIST
PTL 1: JP 2007-520051 A
PTL 2: JP 2007-012854 A
Main roles of a through silicon via in a semiconductor device include signal propagation, clock supply, and power source supply. Since a signal is directly exchanged between semiconductor elements, as a piece of connecting wiring of a through silicon via for propagating a signal, a piece of wiring of a layer close to the semiconductor elements (hereinafter, referred to as “lower layer wiring”) is preferably used. Meanwhile, since a clock and a power source require supplying without loss in a relatively wide range, as a piece of connecting wiring of a through silicon via for supplying a clock and supplying a power source, a piece of wiring of a layer that is capable of lowering wiring resistance, far from the semiconductor elements (hereinafter, referred to as “upper layer wiring”) is preferably used.
However, methods for forming through silicon vias described in the above PTLS 1 and 2 cannot form a through silicon via to be coupled to a piece of upper layer wiring and a through silicon via to be coupled to a piece of lower layer wiring.
The present invention provides a semiconductor device that satisfies a low parasitic resistance and a large allowable current by forming the through silicon via to be coupled to the piece of upper layer wiring and the through silicon via to be coupled to the piece of lower layer wiring.
In order to solve the above problem, according to the present invention, first, a piece of first connecting wiring including a piece of lower layer wiring is formed on a main surface of a substrate and then a piece of second connecting wiring including a piece of upper layer wiring is formed. A first opening that passes through the substrate and reaches the piece of first connecting wiring and a second opening that passes through the substrate and reaches the piece of second connecting wiring, are formed from a back surface of the substrate. A first through silicon via to be coupled to the piece of first connecting wiring and a second through silicon via to be coupled to the piece of second connecting wiring are formed inside the first opening and the second opening, respectively.
According to the present invention, there can be provided a semiconductor device that satisfies a low parasitic resistance and a large allowable current by forming a through silicon via to be coupled to a piece of upper layer wiring and a through silicon via to be coupled to a piece of lower layer wiring.
Problems, configurations, and effects will be clarified in descriptions of the following embodiments other than the problem, the configuration, and the effect that have been described above.
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In the following embodiments, descriptions will be divided into a plurality of sections or embodiments so as to be given when necessary for convenience. Excluding a case where a clear indication is given, they are not mutually irrelevant. For example, one is a part, an entire modification, a detail, or an additional description of the other.
In the following embodiments, in a case where the number of elements (including, for example, a number, a value, a quantity, a range) is referred, the embodiments are not limited to the specific number and the specific number or more or the specific number or less may be applicable, excluding a case where a clear indication is specifically given and a case where the embodiments are clearly limited to the specific number in principle.
In the following embodiments, needless to say, constituent elements (including element steps) are not necessarily mandatory, excluding a case where a clear indication is specifically given and a case where the constituent elements are clearly mandatory in principle.
Referring to “including an A”, “including the A”, “having the A”, and “including the A” does not indicate that elements except the A are eliminated, needless to say, excluding a case where, in particular, it is clearly indicated that there is only the A. Similarly, in the following embodiments, when shapes, position relationships, and the like of, for example, the constitute elements are referred, a shape and the like that are substantially the same or similar to the shapes is included, excluding a case where a clear indication is specifically given and a case where contradiction is clearly made in principle. This is similarly applicable to the above value and range.
The drawings used in the following embodiments may include hatching in order to easily observe the drawings even when being plan views. In the entire drawing for describing the following embodiments, elements having the same functions are denoted with the same reference signs, and the duplicate descriptions thereof will be omitted. The present embodiments will be described in detail below based on the drawings.
First, a through silicon via in the related art will be described before a through silicon via according to a first embodiment will be described.
The through silicon via has a role of supplying a clock and a power source to an entire semiconductor device other than propagation of a signal. Therefore, it is necessary that a piece of connecting wiring and the through silicon via formed in the semiconductor device are coupled and then power supplied from the through silicon via is distributed to the entire semiconductor device.
For example, the above PTL 1 describes a manufacturing process of forming a piece of connecting wiring to be coupled to a through silicon via after the through silicon via is formed by filling a metal film in an opening formed in a silicon substrate. The above PTL 2 describes a manufacturing process of forming simultaneously a first wiring pattern and a second wiring pattern by a multilayer wiring structure on the side of a front surface of a semiconductor substrate, forming a through hole that passes through only the semiconductor substrate from a back surface of the semiconductor substrate, filling a metal film into the through hole, and forming a through via to be coupled to the second wiring pattern.
As described above, since a signal is directly exchanged between semiconductor elements, a piece of lower layer wiring is preferable used for a piece of connecting wiring of a through silicon via for propagating a signal. Meanwhile, since a clock and a power source require supplying without loss in a relatively wide range, as a piece of connecting wiring of a through silicon via for supplying a clock and for supplying a power source, apiece of upper layer wiring is preferably used. However, for example, in each of the manufacturing processes described in the above PTLS 1 and 2, the piece of connecting wiring is limited to the same wiring layer.
In a case where the piece of lower layer wiring is only used for the piece of connecting wiring, it is necessary that the piece of connecting wiring and the piece of upper layer wiring be coupled through a plurality of wiring layers and connecting holes. Therefore, a parasitic resistance becomes high and then power consumption increases. Since current density that can be tolerated by one through silicon via is limited, it is necessary to increase the number of through silicon vias.
Meanwhile, in a case where the piece of upper layer wiring is only used for the piece of connecting wiring, it is necessary that the through silicon via is coupled to a semiconductor element through the piece of multilayer wiring after once the through silicon via is coupled to the piece of connecting wiring, in order to couple the piece of connecting wiring and the semiconductor element. Accordingly, a forming region of the piece of multilayer wiring that can be originally used for other uses is occupied by the piece of multilayer wiring used for connecting with the piece of connecting wiring. A wiring resource that can be used for other uses decreases and then an increase of a size of a chip or an increase of the number of wiring layers occur. In principle, for each through silicon via mutually having a different length, a through silicon via can be formed, for example, based on the method described in the above implementation PTL 2. However, the method drastically increases a manufacturing cost and is unsuitable for practical use.
A semiconductor device according to the first embodiment is a semiconductor device capable of taking out electrical connection to the outside of a chip through each of through silicon vias directly coupled to a piece of upper layer wiring and a piece of lower layer wiring in the same chip.
A method for manufacturing the semiconductor device according to the first embodiment will be sequentially described by following processes with reference to
First, as illustrated in
Here, the piece of metal wiring 200 and the piece of first connecting wiring 210 are formed of the same wiring layer (single layer). The pieces of metal wiring 202 and 203 and the piece of second connecting wiring 220 are formed of the same wiring layer (single layer). The piece of second connecting wiring 220 is formed in a square region measuring 10 μm on a side in plan view.
The pieces of metal wiring 200, 201, 202, and 203, the piece of first connecting wiring 210, and the piece of second connecting wiring 220 include, for example, copper (Cu) as a main component. The wiring interlayer insulating film 310 includes, for example, a silicon oxide and an organic group-containing silicon oxide as main constituent materials. Copper (Cu) is lower than aluminum (Al) in terms of resistivity, and is effective in a method for reducing a wiring delay. The silicon substrate 100 is a substrate that has completed a so-called pre-process. An integrated circuit including, for example, a semiconductor element and a piece of wiring that couples the semiconductor element, are formed in a predetermined region on the main surface of the silicon substrate 100.
Note that, in
Next, as illustrated in
Next, as illustrated in
Note that, here, the resist mask is directly formed on the back surface of the silicon substrate 100. The resist mask may be formed after an insulating material, such as a silicon nitride film or a silicon oxide film, is formed on the back surface of the silicon substrate 100.
Next, as illustrated in
Next, as illustrated in
Next, as illustrated in
Next, for example, ultraviolet rays are irradiated so as to detach the silicon substrate 100 including, for example, the semiconductor element and the piece of multilayer wiring formed thereon from the fixing substrate 130. Then, the silicon substrate 100 is moved and disposed on a dicing tape. Next, a dicing apparatus is used so as to dice the silicon substrate 100 including, for example, the semiconductor element and the piece of multilayer wiring formed thereon. The semiconductor device is competed.
Next, as illustrated in
As described above, according to the first embodiment, the first through silicon via 230 for propagating a signal, to be coupled to the piece of first connecting wiring 210 including the piece of lower layer wiring, can be formed on the main surface of the silicon substrate 100. The second through silicon via 240 for supplying a clock and for supplying a power source, to be coupled to the piece of second connecting wiring 220 including the piece of upper layer wiring, can be formed on the main surface of the silicon substrate 100. Accordingly, the semiconductor device that satisfies a low parasitic resistance and a large allowable current, can be achieved.
A piece of first connecting wiring includes a plurality of pieces of metal wiring due to a limitation of a width of wiring. Therefore, in a case where a first opening that reaches the piece of first connecting wiring is formed on a silicon substrate, there is a problem that a wiring interlayer insulating film between the adjacent pieces of metal wiring is etched and then reliability of wiring decreases. According to a second embodiment, there is provided a technique capable of preventing the reliability of wiring from decreasing even when the wiring interlayer insulating film between the adjacent pieces of metal wiring is etched.
A semiconductor device according to the second embodiment is a semiconductor device capable of taking out electrical connection to the outside of a chip through each of through silicon vias directly coupled to a piece of upper layer wiring and a piece of lower layer wiring in the same chip. A point different from the above first embodiment is that the piece of first connecting wiring includes a two-layered piece of metal wiring.
A method for manufacturing the semiconductor device according to the second embodiment will be sequentially described by following processes with reference to
First, as illustrated in
Here, the piece of metal wiring 200 and the piece of first connecting wiring (A) 210 are formed of the same wiring layer (single layer). The piece of metal wiring 201 and the piece of first connecting wiring (B) 211 are formed of the same wiring layer (single layer). The pieces of metal wiring 202 and 203 and the piece of second connecting wiring 220 are formed of the same wiring layer (single layer). As illustrated in
The pieces of metal wiring 200, 201, 202, and 203, the piece of first connecting wiring (A) 210, the piece of first connecting wiring (B) 211, and the piece of second connecting wiring 220, include, for example, copper (Cu) as a main component. The wiring interlayer insulating film 310 includes, for example, a silicon oxide and an organic group-containing silicon oxide as main constituent materials. Copper (Cu) is lower than aluminum (Al) in terms of resistivity, and is effective in a method for reducing a wiring delay. The silicon substrate 100 is a substrate that has completed a so-called pre-process. An integrated circuit including, for example, a semiconductor element and a piece of wiring that couples the semiconductor element, are formed in a predetermined region on the main surface of the silicon substrate 100.
Note that, in
Next, as illustrated in
Next, as illustrated in
Note that, here, the resist mask is directly formed on the back surface of the silicon substrate 100. The resist mask may be formed after an insulating material, such as a silicon nitride film or a silicon oxide film, is formed on the back surface of the silicon substrate 100.
Next, as illustrated in
Here, the piece of first connecting wiring (A) 210 includes a plurality of pieces of metal wiring disposed and spaced apart from each other. Accordingly, the wiring interlayer insulating film 310 between the adjacent pieces of metal wiring included in the first connecting wiring (A) 210 is etched by over-etching when the first opening 401 is formed. However, as illustrated in
Since the dry etching method having large anisotropy is used to remove the back surface insulating film 320 and the device protecting insulating film 300, the back surface insulating film 320 formed on the inner wall of each of the first through hole 400 and the second through hole 410 can remain keeping its original thickness.
Next, as illustrated in
Next, as illustrated in
Next, for example, ultraviolet rays are irradiated so as to detach the silicon substrate 100 including, for example, the semiconductor element and the piece of multilayer wiring formed thereon from the fixing substrate 130. Then, the silicon substrate 100 is moved and disposed on a dicing tape. Next, a dicing apparatus is used so as to dice the silicon substrate 100 including, for example, the semiconductor element and the piece of multilayer wiring formed thereon. The semiconductor device is competed.
Next, as illustrated in
The piece of first connecting wiring (A) includes pieces of metal wiring 250, 251, 252, and 253 in the same wiring layer. Each of the pieces of metal wiring 250, 251, 252, and 253 has a width of wiring defined as W1. The adjacent pieces of metal wiring 250, 251, 252, and 253 are spaced apart from each other with a distance defined as 51. Similarly, the piece of first connecting wiring (B) includes pieces of metal wiring 260, 261, and 262 in the same wiring layer. Each of the pieces of metal wiring 260, 261, and 262 has a width of wiring defined as W2. The adjacent pieces of metal wiring 260, 261, and 262 are spaced apart from each other with a distance defined as S2.
Each of the pieces of metal wiring 250, 251, 252, and 253 included in the piece of first connecting wiring (A) is formed so as to have the width of wiring W1 and extend in a Y direction. Each of the pieces of metal wiring 250, 251, 252, and 253 is formed so as to have a wiring interval S1 and be spaced apart from each other in parallel in a X direction perpendicular to the Y direction.
Each of the pieces of metal wiring 260, 261, and 262 included in the piece of first connecting wiring (B) is formed so as to have the width of wiring W2 and extend in the Y direction. Each of the pieces of metal wiring 260, 261, and 262 is formed so as to have a wiring interval S2 and be spaced apart from each other in parallel in the X direction.
According to the second embodiment, a center of the width of each of the pieces of metal wiring 260, 261, and 262 in the X direction corresponds to a center of the gap of each of the pieces of metal wiring 250, 251, 252, and 253 in the X direction.
The width of wiring W2 of each of the pieces of metal wiring 260, 261, and 262 is larger than the wiring interval S1 of each of the pieces of metal wiring 250, 251, 252, and 253. Furthermore, a center of the width of each of the pieces of metal wiring 251 and 252 in the X direction corresponds to a center of the gap of each of the pieces of metal wiring 260, 261, and 262. The width of wiring W1 of each of the pieces of metal wiring 251 and 252 is larger than the wiring interval S2 of each of the pieces of metal wiring 260, 261, and 262.
Accordingly, the inside of the first through silicon via 230 is covered with any of the pieces of metal wiring 250, 251, 252, and 253 included in the piece of first connecting wiring (A) or the pieces of metal wiring 260, 261, and 262 included in the piece of first connecting wiring (B). That is, in plan view, a region where the first through silicon via 230 is formed is completely covered with the piece of first connecting wiring (A) and the piece of first connecting wiring (B).
According to the second embodiment, based on a layout limitation of a forming process of the piece of metal wiring, the width of wiring W1 of each of the pieces of metal wiring 250, 251, 252, and 253, and the width of wiring W2 of each of the pieces of metal wiring 260, 261, and 262, are set to be, for example, 0.8 μm. The wiring interval S1 of each of the pieces of metal wiring 250, 251, 252, and 253, and the wiring interval S2 of the pieces of metal wiring 260, 261, and 262, are set to be, for example, 0.2 μm.
According to the second embodiment, the pieces of metal wiring 250, 251, 252, and 253 included in the piece of first connecting wiring (A) and the pieces of metal wiring 260, 261, and 262 included in the piece of first connecting wiring (B) are electrically coupled through connecting holes 520, 521, 522, 523, 524, and 525. In plan view, each of the connecting holes 520, 521, 522, 523, 524, and 525 is laid out so that the pieces of metal wiring 250, 251, 252, and 253 included in the piece of first connecting wiring (A) and the pieces of metal wiring 260, 261, and 262 included in the piece of first connecting wiring (B) overlap.
According to the second embodiment, the connecting holes 520, 521, 522, 523, 524, and 525 that couple the pieces of metal wiring 250, 251, 252, and 253 included in the first connecting wiring (A) and the pieces of metal wiring 260, 261, and 262 included in the first connecting wiring (B), are disposed outside the first through silicon via 230.
According to the second embodiment, a piece of circuit wiring 280 for coupling the first through silicon via 230 and a semiconductor element formed on a silicon substrate, is formed on the same wiring layer as the piece of first connecting wiring (A) is formed. For example, the piece of circuit wiring 280 is integrally formed with the piece of metal wiring 253 included in the piece of first connecting wiring (A).
In the semiconductor device manufactured as described above, a series resistance of the first through silicon via, the piece of first connecting wiring (A), and the piece of first connecting wiring (B) was evaluated by the Kelvin method.
As illustrated in
Next, a cross-sectional structure of a connecting portion of each of the first through silicon via, the piece of first connecting wiring (A), and the piece of first connecting wiring (B) was evaluated by a scanning electron microscope.
As illustrated in
As described above, according to the second embodiment, the first through silicon via 230 for propagating a signal, to be coupled to the piece of first connecting wiring (A) 210 and the piece of first connecting wiring (B) 211 including the lower layer wiring, can be formed on the main surface of the silicon substrate 100. The second through silicon via 240 for supplying a clock and for supplying a power source, to be coupled to the piece of second connecting wiring 220 including the upper layer, can be formed on the main surface of the silicon substrate 100. Accordingly, the semiconductor device that satisfies a low parasitic resistance and a large allowable current, can be achieved.
Furthermore, the two wiring layers including the piece of first connecting wiring (A) 210 and the piece of first connecting wiring (B) 211 perform electrical connection with the first through silicon via 230. In plan view, the pieces of metal wiring included in the piece of first connecting wiring (A) 210 and the pieces of metal wiring included in the piece of first connecting wiring (B) 211 are disposed so as to completely cover the region where the first through silicon via 230 is formed. Accordingly, degradation of reliability of wiring can be inhibited.
First modification to ten modification of the first and second embodiments will be described below.
According to the second embodiment, the width of wiring W1 of each of the pieces of metal wiring included in the piece of first connecting wiring (A) and the width of wiring W2 of each of the pieces of metal wiring included in the piece of first connecting wiring (B) are set to be 0.8 μm. The wiring interval S1 between the adjacent pieces of metal wiring included in the piece of first connecting wiring (A) and the wiring interval S2 between the adjacent pieces of metal wiring included in the piece of first connecting wiring (B) are set to be 0.2 μm. The widths of wiring W1 and W2 and the wiring intervals S1 and S2 are not limited to these.
Basically, the widths of wiring W1 and W2 and the wiring intervals S1 and S2 may be selected in accordance with a layout rule of the wiring layers in which the pieces of metal wiring included in the piece of first connecting wiring (A) and the pieces of metal wiring included in the piece of first connecting wiring (B) are formed. In an allowable range of the layout rule, the widths of wiring W1 and W2 are preferably as wide as possible and the wiring intervals S1 and S2 are preferably as narrow as possible.
Based on the widths of wiring W1 and W2 and the wiring intervals S1 and S2, in plan view, the number of the pieces of metal wiring included in the piece of first connecting wiring (A) and the number of the pieces of metal wiring included in the piece of first connecting wiring (B) are laid out so as to be numbers necessary for perfectly covering the first through silicon via.
In a case where the widths of wiring W1 and W2 and the wiring intervals S1 and S2 are constant, when a length of each of the pieces of metal wiring included in the piece of first connecting wiring (A) and a length of each of the pieces of metal wiring included in the piece of first connecting wiring (B) lengthen and the number of the pieces of metal wiring included in the piece of first connecting wiring (A) and the number of the pieces of metal wiring included in the piece of first connecting wiring (B) increase, the width (or depth) of each of the piece of first connecting wiring (A) and the piece of first connecting wiring (B) increases. Therefore, even when aligning accuracy of the first through silicon via is low, electrical connection can be securely performed. Meanwhile, there is a problem that a wiring area that can be used for circuit connection decreases and a parasitic capacitance of the first through silicon via increases as the width (or depth) of each of the piece of first connecting wiring (A) and the piece of first connecting wiring (B) increases. Therefore, the width (or depth) of each of the piece of first connecting wiring (A) and the piece of first connecting wiring (B) is preferably set to be substantially a size including an aligning margin plus the width (or depth) of the first through silicon via.
According to the second embodiment, the center of the width of wiring W1 of each of the pieces of metal wiring included in the piece of first connecting wiring (A) and the center of the wiring interval S2 between the adjacent pieces of metal wiring included in the piece of first connecting wiring (B) are laid out so as to correspond to each other. The center of the width of wiring W2 of each of the pieces of metal wiring included in the piece of first connecting wiring (B) and the wiring interval S1 between the adjacent pieces of metal wiring included in the piece of first connecting wiring (A) are laid out so as to correspond to each other. However, they do not necessarily correspond to each other.
A pattern formed by a disjunction of the width of wiring W1 of each of the pieces of metal wiring included in the piece of first connecting wiring (A) and the width of wiring W2 of each of the pieces of metal wiring included in the piece of first connecting wiring (B) may completely cover the first through silicon via in plan view. However, since the pieces of metal wiring included in the piece of first connecting wiring (A) and the pieces of metal wiring included in the piece of first connecting wiring (B) need to be electrically coupled to each other by the connecting holes, they need to have aligning margins necessary for forming the connecting holes so as to be overlapped each other.
According to the second embodiment, in plan view, the connecting holes that couple the pieces of metal wiring included in the piece of first connecting wiring (A) and the pieces of metal wiring included in the piece of first connecting wiring (B) are laid out outside the first through silicon via. They can be also laid out inside the first through silicon via in plan view. In this case, since the total number of the connecting holes can increase, a decrease of a parasitic resistance can be achieved. However, in a case where the first opening in which the first through silicon via is embedded is formed, when the pieces of metal wiring included in the piece of first connecting wiring (A) have been completely etched, a protruding step is formed in the wiring interlayer insulating film. Therefore, when a conductive material is embedded in the first opening, degradation of reliability of wiring may occur.
According to the second embodiment, the two wiring layers including the piece of first connecting wiring (A) and the piece of first connecting wiring (B) perform the electrical connection with the first through silicon via. Three wiring layers or more can be used. As the distance between the base of the piece of first connecting wiring (A) including the lower layer wiring and the base of the piece of second connecting wiring including the upper layer wiring, 2.0 μm is exemplified (distance H illustrated in the above
In a case where etching selectivity of a metal material of the pieces of metal wiring included in the piece of first connecting wiring (A) to an insulating material included in the wiring interlayer insulating film (etching speed of the insulating material/etching speed of the metal material) is defined as α, when a relationship in which a total thickness of each of the pieces of metal wiring included in the piece of first connecting wiring (A) in an etching direction is larger than H/αis satisfied, the number of wiring layers used for the piece of first connecting wiring (A) and the distance between the base of the piece of first connecting wiring (A) and the base of the piece of second connecting wiring can be changed.
That can be also said regarding the distance between the base of the piece of first connecting wiring including the lower layer wiring and the base of the piece of second connecting wiring including the upper layer wiring (distance H illustrated in the above
According to the second embodiment, in order to couple the first through silicon via to the semiconductor element, the piece of circuit wiring is coupled to the piece of metal wiring at the outermost position of the piece of first connecting wiring (A). The piece of circuit wiring may be coupled to another piece of metal wiring included in the piece of first connecting wiring (A) or can be coupled to a piece of metal wiring included in the piece of first connecting wiring (B).
In a case where the piece of circuit wiring is coupled to the silicon substrate, coupling the piece of circuit wiring to the piece of first connecting wiring (A) close to the silicon substrate can effectively use a wiring resource.
According to the first and second embodiments, as the piece of second connecting wiring, the piece of metal wiring having a single-layered square measuring 10 μm on a side is used. The piece of second wiring is not limited to the form.
Basically, it is necessary to follow a layout rule of the wiring layer in which the piece of second connecting wiring is disposed. When allowed by the layout rule, a single-layered wiring layer preferably perfectly covers the second through silicon via plus an aligning margin. In a case where two wiring layers or more cover the second through silicon via, for example, in accordance with the method for laying out the piece of first connecting wiring (A) and the piece of first connecting wiring (B) according to the second embodiment, a piece of metal wiring in each of the wiring layers included in the piece of second connecting wiring is individually laid out. That is, using the two wiring layers or more, in a region where the second through silicon via is formed, a pattern formed by a disjunction of a width of wiring of the piece of metal wiring in each of the wiring layers included in the second connecting wiring may perfectly cover the second through silicon via in plan view.
According to the second embodiment, a square is used for the shape of the first through silicon via in plan view. Shapes other than the square may be used. For example, a rectangle, a hexagon, an octagon, or a circle may be used. The first through silicon via and the second through silicon via do not necessarily the same shape. For example, the second through silicon via directly coupled to the piece of second connecting wiring supplies a clock and a power source. Therefore, the width of the second through silicon via (diameter) can also increase for a low resistance.
In order to improve flatness of a piece of metal wiring, a dummy metal in an electrically floating state is often formed in a region between adjacent pieces of metal wiring. However, when the first through silicon via and the second through silicon via are etched, the dummy metal becomes an etching barrier. Therefore, the dummy metal is preferably not formed in the region where the first through silicon via and the second through silicon via are formed.
According to the first and second embodiments, the silicon substrate including the semiconductor element formed thereon is temporarily fixed to the fixing substrate including a silicon oxide by the adhesive. The present invention is not limited to this. For example, the fixing substrate may be a silicon substrate and, as an adhesive, a resin for fixing permanently, such as a polyimide, can be used.
According to the first and second embodiments, the single-layered semiconductor device is laminated on the chip mounting member in a state where the main surface including the semiconductor element formed thereon faces up (Face-up state). Other layered forms can be used. The number of lamination layers may be two or more. Lamination may be performed in a case where the main surface including the semiconductor element formed thereon faces down (Face-down state) if necessary.
The present invention made by the present inventors has been specifically described based on the embodiments. The present invention is not limited to the above embodiments. Needless to say, various alternations may be made without departing from the spirit.
100 silicon substrate
120 chip mounting member
130 fixing substrate
200, 201, 202, 203, 204, 205, 206 metal wiring
210 first connecting wiring, first connecting wiring (A)
211 first connecting wiring (B)
220 second connecting wiring
230 first through silicon via
240 second through silicon via
250, 251, 252, 253 metal wiring
260, 261, 262 metal wiring
270 solder bump
280 circuit wiring
300 device protecting insulating film
310 wiring interlayer insulating film
320 back surface insulating film
340 adhesive
400, 401 first opening
400A first through hole
410A second through hole
410,411 second opening
520, 521, 522, 523, 524, 525 connecting hole
H distance
S1, S2 wiring interval
W1, W2 width of wiring
Filing Document | Filing Date | Country | Kind |
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PCT/JP2013/068511 | 7/5/2013 | WO | 00 |