Number | Date | Country | Kind |
---|---|---|---|
9-142447 | May 1997 | JP |
Number | Name | Date | Kind |
---|---|---|---|
5518962 | Murao | May 1996 | A |
5532516 | Pasch et al. | Jul 1996 | A |
5616959 | Jeng | Apr 1997 | A |
5716890 | Yao | Feb 1998 | A |
5883433 | Oda | Mar 1999 | A |
5990001 | Oda | Nov 1999 | A |
5990555 | Ohori et al. | Nov 1999 | A |
Number | Date | Country |
---|---|---|
3-209828 | Sep 1991 | JP |
5-6939 | Jan 1993 | JP |
5-259297 | Oct 1993 | JP |
6-349950 | Dec 1994 | JP |
8-46038 | Feb 1996 | JP |
8-107149 | Apr 1996 | JP |
8-139194 | May 1996 | JP |
8-167650 | Jun 1996 | JP |
9-36116 | Feb 1997 | JP |
H9-64034 | Mar 1997 | JP |
Entry |
---|
K. Mikagi et al., “Barrier Metal Free Copper Damascene Interconnection Technology Using Atmospheric Copper Reflow and Nitrogen Doping in SiOF Film”, IEDM Technical Digest, Dec., 1996, pp. 1-4. |
Thomas Zoes et al., “Planarization Performance of Flowable Oxide In The Sub-0.5 μm Regime”, Conference Proceedings, ULSI XI. 1996 Materials Research Society, pp. 121-125. |