Claims
- 1. A solder-bumped integrated circuit die comprising
- a substrate,
- a passivation layer overlying the substrate, said passivation layer being formed of a material nonwettable by a solder metal and defining an opening,
- a metal contact exposed through said opening,
- a terminal formed of an electrically conductive, solder-wettable material comprising copper particles and a polymeric binder, said terminal comprising a bond pad overlying said passivation layer spaced apart from the metal contact and a runner section extending from the bond pad and connected to the metal contact for conducting electrical signals between the bond pad and the metal contact, and
- a solder bump bonded to the bond pad.
- 2. A solder-bumped integrated circuit die comprising
- a silicon substrate,
- a passivation layer overlying the silicon substrate and formed of a dielectric polymer nonwettable by a solder metal, said passivation layer defining an opening,
- an aluminum metal contact on said silicon substrate and exposed through said opening,
- a terminal formed of an electrically conductive, solder-wettable material comprising silver-coated copper particles and a resol type phenol resin binder, said terminal comprising a bond pad overlying said passivation layer spaced apart from the aluminum metal contact and a runner section extending from the bond pad and connected to the aluminum metal contact for conducting electrical signals between the bond pad and the aluminum metal contact and
- a solder bump bonded to the bond pad.
Parent Case Info
This is a division of copending application Ser. No. 07/876,147, filed on Apr. 30, 1992.
US Referenced Citations (17)
Foreign Referenced Citations (7)
Number |
Date |
Country |
59-217336 |
Dec 1984 |
JPX |
63-240054 |
Oct 1988 |
JPX |
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01124273 |
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03073503 |
Mar 1991 |
JPX |
04352383 |
Dec 1992 |
JPX |
Non-Patent Literature Citations (3)
Entry |
W. E. Mutter et al. "AG Metallurgy System for Integrated Circuit Devices", IBM Technical Disclosure Bulletin, vol. 13, No. 2, Jul. 1970, pp. 511-512. |
R. T. Howard, "Edge Seal for Multilevel Integrated Circuit With Organic Interlevel Dielectric", IBM Technical Disclosure Bulletin vol. 20, No. 8, Jan. 1978, pp. 3002-3003. |
MINICO 6300: Advertisement received from Minico. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
876147 |
Apr 1992 |
|