Substrate and manufacturing method of package structure

Abstract

A substrate board and a manufacturing method of a package structure are provided. The substrate board includes a first surface, a die-attaching area, a cutting area, a plurality of first pads and a first solder mask. The die-attaching area for attaching a die is located on the first surface. The first pads are disposed on the first surface. The first solder mask is partially disposed on the first surface to expose part of the cutting area and the first pads. The first solder mask is divided into a first inner solder mask and a first outer solder mask via the cutting area. The die-attaching area and the first pads are located in the first inner solder mask. Wherein, part of the first mask is located on the cutting area for connecting the first inner solder mask and the first outer solder mask.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A (Prior Art) illustrates a first surface of a conventional substrate;

FIG. 1B (Prior Art) illustrates a second surface of the conventional substrate;

FIG. 2A illustrates a first surface of a substrate according to a first embodiment of the invention;

FIG. 2B illustrates a second surface of the substrate in FIG. 2A;

FIG. 3 is a flow chart of a manufacturing method of a package structure using the substrate according to the invention;

FIGS. 4A˜4G illustrate steps of the manufacturing method in FIG. 3;

FIG. 5 illustrates the substrate in FIG. 4E along a cross-sectional line 5-5′;

FIG. 6A illustrates a first surface of a substrate according to a second embodiment of the invention; and

FIG. 6B illustrates the second surface of the substrate according to the second embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

First Embodiment

Please referring to FIG. 2A, a first surface 100a of a substrate 100 according to a first embodiment of the invention is illustrated in FIG. 2A. The substrate 100 includes the first surface 100a, a die-attaching area 180, a cutting area L100, several first pads 130 and a first solder mask 110. The die-attaching are 180 is for attaching a die (not shown in FIG. 2A). The first pads 130 are disposed on the first surface 100a. The first solder mask 110 is partially disposed on the first surface 100a and exposes part of the cutting area L100 and the first pads 130.

As shown in a dotted enlarge region in FIG. 2A, the first solder mask 110 is substantially divided into a first inner solder mask 111 and a first outer solder mask 112 via the cutting area L100. The die-attaching area 180 and the first pads 130 are located in the first inner solder mask 111. Part of the first solder mask 110 is formed on the cutting area L110 for connecting the first inner solder mask 111 and the first outer solder mask 112.

When the edges of the substrate 100 crack, the cracks only extend from the edges to a bare area of the first solder mask 110 and not easily extend to the first inner solder mask 111.

Furthermore, when a cutter cuts the substrate 100 along the cutting area L100, most of the first solder mask 110 does not contact the cutter directly. Only a little portion of the first solder mask 110 directly contacts the cutter. Therefore, the stress that the first solder mask 110 bears is reduced greatly. Through experiments, the stress that the first solder mask 110 bears is proved to be reduced to a certain level, such that the first solder mask 110 does not peel off due to the stress.

Moreover, the first solder mask 110 further includes a first strip solder mask 113 connecting the first inner solder mask 111 and the first outer solder mask 112. The substrate 100 further includes a first circuit structure 160 passing through the cutting area L110. Generally, the first circuit structure 160 is an electroplated circuit or a test circuit. The first strip solder mask 113 covers the first circuit structure 160 for preventing the first circuit structure 160 from oxidizing due to exposure to the air.

Moreover, because the first circuit structure 160 is an extremely thin (the thickness substantially less than 100 um), the circuit structure 160 is very fragile. When the first circuit structure 100 is pulled under stress, the first circuit structure 160 is easily deformed or peels off. Because the first strip solder mask 113 covers the first circuit structure 160, the first circuit structure 160 does not contact the cutter directly The damage of the stress is reduced.

Please referring to FIG. 2B, a second surface 100b of the substrate 100 in FIG. 2A is illustrated in FIG. 2B. The substrate 100 further includes the second surface 100b, several second pads 140 and a second solder mask 120. Preferably, the second surface 100b of the substrate 100 has the same structure design of the first surface 100a. The second pads 140 are disposed on the second surface 100b. The second solder mask 120 is partially disposed on the second surface 100b and exposes part of the cutting area L100 and the second pads 140.

As shown in a dotted enlarged region in FIG. 2B, the second solder mask 120 is substantially divided into a second inner area 121 and a second outer area 122. The second pads 140 are corresponding to the second inner area 121. Part of the second solder mask 120 is located on the cutting area L100 for connecting the second inner area 121 and the second outer area 122.

Besides, the second solder mask 120 further includes at least a second strip area 123 connecting the second inner area 121 and the second outer area 122. The substrate 100 further includes a second circuit structure 170 passing through the cutting area L100. The second circuit structure 170 does not have to be disposed correspondingly to the first circuit structure 160. However, no matter where the second circuit structure 170 is disposed, the second strip area 123 is disposed correspondingly to the second circuit structure 170 and covers the second circuit structure 170.

Because the first surface 100a and the second surface 100b of the substrate 100 have the above structure designs, the first solder mask 110 or the second solder mask 120 does not crack or peel off easily. Furthermore, the first circuit structure 160 and the second circuit structure 170 are protected from oxidation, deformation or peeling.

A manufacturing method of a package structure 500 using the substrate 100 is illustrated as follow.

Please refer to FIG. 3 and FIGS. 4A˜4G. FIG. 3 is a flow chart of the manufacturing method of the package structure 500 using the substrate 100 according to the invention. FIGS. 4A˜4G illustrate steps of the manufacturing method in FIG. 3. First, in a step S1 in FIG. 3, the substrate 100 is provided, as shown in FIG. 4A. The substrate 100 includes the first surface 100a, the die-attaching area 180 and the cutting area L100. The die-attaching area 180 is located on the first surface 100a for attaching a die 300 (as shown in FIG. 4D).

Before the substrate 100 is separated, the substrate 100 is planned to be several package units. Each package unit is used for attaching one die 300 to form an independent package structure. Only one package structure is illustrated in FIG. 4B as an example.

Next, in a step S2 in FIG. 3, the first solder mask 110 is formed on the first surface 100a and exposes part of the cutting area L100 and several first pads 130 as shown in FIG. 4B. The first solder mask 110 is substantially divided into the first inner solder mask 111 and the first outer solder mask 112. The die-attaching area 180 and the first pads 130 are located in the first inner solder mask 111. The first pads 130 are arranged in the die-attaching area 180 as an array. Part of the first solder mask 110 is located on the cutting area L100 for connecting the first inner solder mask 111 and the first outer solder mask 112.

Meanwhile, as shown in FIG. 4C, a second solder mask 120 exposing part of the cutting area L100 and several second pads 140 is formed on a second surface 100b. The second solder mask 120 is substantially divided into a second inner area 121 and a second outer area 122. The second pads 140 are located in the second inner area 121 and arranged in the second inner area 121 as an array. Part of the second solder mask 120 is located on the cutting area L100 for connecting the second inner area 121 and the second outer area 122.

As shown in FIGS. 4B˜4C, in a step S2, at least a groove 190 is further formed on the cutting area L100. The groove 190 penetrates part of the first surface 100a and part of the second surface 100b. Four grooves 190 disposed on four sides of the cutting area L100 are narrow. Only four corners of the cutting area L100 support each package unit.

Then, in a step S3 in FIG. 3, a die-attaching step is performed as shown in FIG. 4D. The die 300 is attached in the die-attaching area 180. In the die-attaching step, the die 300 is electrically connected to the substrate 100 through flip-chip bonding.

In the present embodiment, the first pads 130 are arranged as an array in the die-attaching area 180 as an example, and the die 300 is electrically connected to substrate 100 through flip-chip bonding. However, the first pads 130 can be disposed around the die-attaching area 180, and the die 300 can be electrically connected to the substrate 100 through wire-bonding. The structure design of the present invention can be applied to all kinds of arrangement of the dies 300.

Then, as shown in FIG. 4E, a sealing step is performed to form a sealant 400 covering the die 300 and the die-attaching area 180.

Afterwards, as shown in FIG. 4F, a ball planting step is performed to form several solder balls 600 on the second pads 140.

Subsequently, a cutting step is performed in a step S4 in FIG. 3, as shown in FIG. 4G and FIG. 5. FIG. 5 illustrates the substrate 100 in FIG. 4E along a cross-sectional line 5-5′. In the present embodiment, the substrate 100 is cut by a punching method. The substrate 100 is cut by a cutter 700 along the cutting area L100 for forming a package structure 500. However, the cutting method is not limited thereto. The structure design of the invention can be adjusted according to different cutting methods. The stress still can be reduced through the structure design of the invention.

Second Embodiment

A substrate 200 of the present embodiment and the substrate 100 of the first embodiment are different in the number of the first strip solder masks 213 and the second strip areas 223. The same parts are not illustrated repeatedly. Please refer to FIGS. 6A˜6B. FIG. 6A illustrates a first surface 200a of a substrate 200 according to the second embodiment of the invention. FIG. 6B illustrates a second surface 200b of the substrate 200 according to the second embodiment of the invention.

As shown in FIG. 6A, the first solder mask 210 includes several first strip solder masks 213. The first strip solder masks 213 are substantially perpendicular to the cutting area L200 and connect the first inner solder mask 211 and the first outer solder mask 212. The first strip solder masks 213 cover the first circuit structure 260 in the substrate 200 for protecting the first circuit structure 260 from oxidiation, deformation or peeling off.

As shown in FIG. 6B, the second solder mask 220 includes several second strip areas 223. The strip areas 223 are substantially perpendicular to the cutting area L200 and connect the second inner area 221 and the second outer area 222. The second strip areas 223 cover the second circuit structure 270 in the substrate 200 for protecting the second circuit structure 270 from oxidation, deformation or peeling off.

Furthermore, the first strip solder masks 213 and the second strip areas 223 disposed perpendicular to the cutting area L200 are narrow. Therefore, the cracks occurring at the edges of the first solder mask 210 or the second solder mask 220 on the substrate 200 do not pass through the narrow first strip solder masks 213 and the second strip areas 223. The cracks do not extend to the first inner solder mask 211 and the second inner area 221.

Besides, in the cutting step, the cutter only contacts the narrow first strip solder masks 213 and the second strip areas 223. Through experiments, the stress that the first solder mask 210 and the second solder mask 220 bear is proved to be relatively low, such that the first solder mask 210 and the second solder mask 220 do not peel off due to the stress.

In the substrate and the manufacturing method of the package structure using the same according to the above embodiments of the invention, the first/second solder mask exposes part of the cutting area. Also, part of the first/second solder mask is located on the cutting area for connecting the first/second inner area and the first/second outer area. Therefore, the substrate and the manufacturing method of the package structure using the same at least include following advantages:

First, the cracks do not extend. The first/second solder mask is substantially divided into the first/second inner area and the first/second outer area via the cutting area. The cracks occurring at the edges of the first/second solder mask on the substrate do not extend to the central region and stop in the bare area of the first/second solder mask.

Second, the damage caused by stress is reduced. In the cutting step, the cutter only directly contacts the first/second strip area. Therefore, the stress that the first/second solder mask bears does not cause any damage.

Third, the first/second circuit structure is prevented from oxidation. The first/second strip area covers the first/second circuit structure to prevent the first/second circuit structure from exposing to the air. As a result, the first/second circuit structure is not oxidized.

Fourth, the first/second circuit structure is prevented from deformation or peeling off. The first/second circuit structure does not contact the cutter directly because the first/second strip area covers the first/second circuit structure. Therefore, the damage caused by pulling of stress is reduced.

While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.

Claims

1. A substrate comprising: a first surface;a die-attaching area located on the first surface for attaching a die;a cutting area;a plurality of first pads disposed on the first surface; anda first solder mask partially disposed on the first surface to expose part of the cutting area and the first pads, the first solder mask substantially divided into a first inner solder mask and a first outer solder mask via the cutting area, the die-attaching area and the first pads located in the first inner solder mask;wherein part of the first solder mask is located on the cutting area for connecting the first inner solder mask and the first outer solder mask.

2. The substrate according to claim 1, wherein the first solder mask further comprises at least a first strip solder mask connecting the first inner solder mask and the first outer solder mask.

3. The substrate according to claim 2 further comprising: a first circuit structure, the first strip solder mask covering the first circuit structure.

4. The substrate according to claim 2, wherein the first solder mask comprises a plurality of first strip solder mask substantially perpendicular to the cutting area, the first strip solder mask connecting the first inner solder mask and the first outer solder mask.

5. The substrate according to claim 1 further comprising: a second surface;a plurality of second pads disposed on the second surface; anda second solder mask partially disposed on the second surface to expose part of the cutting area and the second pads, the second solder mask substantially divided into a second inner area and a second outer area via the cutting area, the second pads correspondingly located in the second inner area;wherein part of the second solder mask is located on the cutting area for connecting the second inner area and the second outer area.

6. The substrate according to claim 5, wherein the second solder mask further comprises at least a second strip area connecting the second inner area and the second outer area.

7. The substrate according to claim 6 further comprising: a second circuit structure, the second strip area covering the second circuit structure.

8. The substrate according to claim 5, wherein second solder mask comprises a plurality of second strip areas substantially perpendicular to the cutting area and connecting the second inner area and the second outer area.

9. The substrate according to claim 5 further comprising: a groove penetrating part of the first surface and part of the second surface, the groove formed in part of the cutting area.

10. The substrate according to claim 9, wherein the groove is a narrow groove.

11. The substrate according to claim 1, wherein the first pads are arranged in the die-attaching area in an array.

12. The substrate according to claim 1, wherein the first pads are around the die-attaching area.

13. A manufacturing method of a package structure, the method comprising: providing a substrate comprising a first surface, a die-attaching area and a cutting area, the die-attaching area located on the first surface for attaching a die;forming a first solder mask on the first surface and exposing part of the cutting area and a plurality of first pads, the first solder mask substantially divided into a first inner solder mask and a first outer solder mask, the die-attaching area and the first pads located in the first inner solder mask, wherein part of the first solder mask is located on the cutting area for connecting the first inner solder mask and the first outer solder mask;performing a die-attaching step to attach the die in the die-attaching area; andperforming a cutting step to cut the substrate along the cutting area for forming a package structure.

14. The method according to claim 13, wherein the first solder mask further comprises at least a first strip solder mask connecting the first inner solder mask and the first outer solder mask.

15. The method according to claim 14,- wherein the first strip solder mask covers a first circuit structure.

16. The method according to claim 14, wherein the first solder mask comprises a plurality of first strip solder masks substantially perpendicular to the cutting area and connecting the first inner solder mask and the first outer solder mask.

17. The method according to claim 13, wherein the substrate further comprises a second surface, the method further comprising: forming a second solder mask on the second surface and exposing part of the cutting area and a plurality of second pads before the step of attaching the die, the solder mask substantially divided into a second inner area and a second outer area via the cutting area, the second pads located in the second inner area, part of the second solder mask located on the cutting area for connecting the second inner area and the second outer area.

18. The method according to claim 17, wherein the second solder mask further comprises a second strip area connecting the second inner area and the second outer area.

19. The method according to claim 18, wherein the second strip area covers a second circuit structure.

20. The method according to claim 18, wherein the second solder mask comprises a plurality of second strip areas substantially perpendicular to the cutting area and connecting the second inner area and the second outer area.

21. The method according to claim 13 further comprising: performing a sealing step to form a sealant covering the die and the die-attaching area between the steps of attaching the die and cutting the substrate.

22. The method according to claim 21 further comprising: performing a ball planting step to form a plurality of tin balls on the second pads.

23. The method according to claim 13, wherein the substrate is cut along the cutting area through a punching method in the cutting step.

24. The method according to claim 13, wherein the die is electrically connected to the substrate through wire-bonding in the die-attaching step.

25. The method according to claim 13, wherein the die is electrically connected to the substrate through flip-chip bonding in the die-attaching step.