BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects and features of the present invention will become apparent from the following description of embodiments, given in conjunction with the accompanying drawings, in which:
FIG. 1 is a plan view for schematically showing a configuration of a substrate processing apparatus in accordance with an embodiment of the present invention;
FIG. 2A is a cross sectional view of a second process unit of FIG. 1, which is taken along the line II-II of FIG. 1;
FIG. 2B is an enlarged view of a portion A in FIG. 2A;
FIG. 3 is a perspective view for schematically showing a configuration of a second process ship of FIG. 1;
FIG. 4 describes a schematic configuration of a system controller in the substrate processing apparatus of FIG. 1;
FIG. 5 shows a load port information screen displayed on a display unit of an operation panel when a load start setting function is set to be “valid”;
FIGS. 6A and 6B depict a process unit information screen displayed on the display unit of the operation panel, in which FIG. 6A shows a case where a transfer of wafer into the process unit is not prohibited, and FIG. 6B shows a case where a transfer of wafer into the process unit is prohibited;
FIGS. 7A to 7D illustrate process diagrams for describing a case where the recipe is modified by using a recipe buffering function and a wafer transfer prohibition function;
FIG. 8 is a flow chart illustrating recipe examination procedures performed in the substrate processing apparatus in accordance with a first embodiment of the present invention;
FIG. 9 is a flow chart showing recipe examination procedures performed in the substrate processing apparatus in accordance with a modified example of the first embodiment;
FIG. 10 is a flow chart describing recipe examination procedures performed in the substrate processing apparatus in accordance with a second embodiment of the present invention;
FIG. 11 is a flow chart illustrating recipe examination procedures performed in the substrate processing apparatus in accordance with a modified example of the second embodiment;
FIG. 12 is a plan view for schematically showing a configuration of a substrate processing apparatus in accordance with a first modified example of the embodiment of the present invention;
FIG. 13 is a plan view for schematically showing a configuration of a substrate processing apparatus in accordance with a second modified example of the embodiment of the present invention; and
FIG. 14 presents a block diagram showing a configuration of the EC shown in FIG. 4.