Claims
- 1. A method for improving power and ground flooding in a multilayer circuit board, the multilayer circuit board having a plurality of signal layers, the method comprising the steps of:
forming a plurality of electrically conductive vias, wherein each of the plurality of electrically conductive vias extends through one or more of the plurality of signal layers; routing signals associated with the plurality of electrically conductive vias, thereby creating at least one power/ground flooding channel; and forming at least one power/ground connection within the at least one power/ground flooding channel.
- 2. The method according to claim 1, wherein the at least one power/ground flooding channel is substantially wider than a pitch between two adjacent electrically conductive vias.
- 3. The method according to claim 1, wherein the step of routing signals associated with the plurality of electrically conductive vias comprises at least two stages of channel routing process.
- 4. The method according to claim 1, wherein the signals associated with the plurality of electrically conductive vias are routed in at least one of the following manners:
within the multilayer circuit board; to and from at least one electronic component mounted on a surface of the multilayer circuit board; and to and from a second circuit board.
- 5. The method according to claim 1, wherein the at least one power/ground connection is terminated at a power/ground plane.
- 6. The method according to claim 1, wherein the multilayer circuit board comprises a power/ground patch, the power/ground patch having electrical contact with a plurality of power/ground vias, and the at least one power/ground connection provides power/ground flooding for the power/ground patch.
- 7. The method according to claim 1 further comprising providing thermal dissipation for the multilayer circuit board based at least in part on the at least one power/ground flooding channel.
- 8. The method according to claim 1 further comprising providing mechanical support for the multilayer circuit board based at least in part on the at least one power/ground flooding channel.
- 9. A multilayer circuit board with improved power and ground flooding, the multilayer circuit board comprising:
a plurality of signal layers; a plurality of electrically conductive vias, wherein each of the plurality of electrically conductive vias extends through one or more of the plurality of signal layers; at least one power/ground flooding channel, wherein the at least one power/ground flooding channel is created by routing signals associated with the plurality of electrically conductive vias; and at least one power/ground connection formed within the at least one power/ground flooding channel.
- 10. The multilayer circuit board according to claim 9, wherein the at least one power/ground flooding channel is substantially wider than a pitch between two adjacent electrically conductive vias.
- 11. The multilayer circuit board according to claim 9, wherein the at least one power/ground flooding channel is created based on at least two stages of channel routing process.
- 12. The multilayer circuit board according to claim 9, wherein the signals associated with the plurality of electrically conductive vias are routed in at least one of the following manners:
within the multilayer circuit board; to and from at least one electronic component mounted on a surface of the multilayer circuit board; and to and from a second circuit board.
- 13. The multilayer circuit board according to claim 9, wherein the at least one power/ground connection is terminated at a power/ground plane.
- 14. The multilayer circuit board according to claim 9, wherein the multilayer circuit board comprises a power/ground patch, the power/ground patch having electrical contact with a plurality of power/ground vias, and the at least one power/ground connection provides power/ground flooding for the power/ground patch.
- 15. The multilayer circuit board according to claim 9 further comprising one or more thermal dissipation structures based at least in part on the at least one power/ground flooding channel.
- 16. The multilayer circuit board according to claim 9 further comprising one or more mechanical support structures based at least in part on the at least one power/ground flooding channel.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This patent application claims priority to U.S. Provisional Patent Application No. 60/477,923 (Attorney Docket No. 57983.000117; Client Reference No. 15765ROUS01P), filed Jun. 13, 2003, which is hereby incorporated by reference herein in its entirety.
[0002] This patent application is a continuation-in-part of U.S. patent application Ser. No. 10/101,211 (Attorney Docket No. 57983.000076; Client Reference No. 14918ROUS01U), filed Mar. 20, 2002, which is a continuation-in-part of U.S. patent application Ser. No. 09/651,188 (Attorney Docket No. 57983.000010, Client Reference No. 12623ROUS02U), filed Aug. 30, 2000, now U.S. Pat. No. 6,388,890, which claims priority to U.S. Provisional Patent Application No. 60/212,387, filed Jun. 19, 2000. All of these related patent applications are hereby incorporated by reference herein in their entirety.
Provisional Applications (2)
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Number |
Date |
Country |
|
60212387 |
Jun 2000 |
US |
|
60477923 |
Jun 2003 |
US |
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
10101211 |
Mar 2002 |
US |
Child |
10861387 |
Jun 2004 |
US |
Parent |
09651188 |
Aug 2000 |
US |
Child |
10101211 |
Mar 2002 |
US |