Chung-Cheng LIEN

Person

Hsin-feng, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Communication device and communication method
- Patent number 11,184,053
- Issue date Nov 23, 2021
- Wistron NeWeb Corp.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with capacitors embedded therein
- Patent number 8,642,898
- Issue date Feb 4, 2014
- Unimicron Technology Corp.
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating circuit board structure with capacitors embe...
- Patent number 8,256,106
- Issue date Sep 4, 2012
- Unimicron Technology Corp.
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure embedded with semiconductor chips
- Patent number 7,863,729
- Issue date Jan 4, 2011
- Unimicron Technology Corp.
- Shih Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of circuit boards embedded with semiconductor chips
- Patent number 7,706,148
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure having capacitor array and embedded electro...
- Patent number 7,674,986
- Issue date Mar 9, 2010
- Phoenix Precision Technology Corporation
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of circuit board with semiconductor component embed...
- Patent number 7,656,040
- Issue date Feb 2, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier structure for semiconductor chip and method for manufacturi...
- Patent number 7,619,317
- Issue date Nov 17, 2009
- Phoenix Precision Technology Corporation
- Chung-Cheng Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plate structure having chip embedded therein and the manufacturing...
- Patent number 7,598,610
- Issue date Oct 6, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structure of carrier board embedded with semiconductor compon...
- Patent number 7,514,770
- Issue date Apr 7, 2009
- Phoenix Precision Technology Corporation
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of carrier boards embedded with semiconductor compo...
- Patent number 7,507,915
- Issue date Mar 24, 2009
- Phoenix Precision Technology Corporation
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMMUNICATION DEVICE AND COMMUNICATION METHOD
- Publication number 20210105045
- Publication date Apr 8, 2021
- WISTRON NEWEB CORP.
- Ching-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH CAPACITORS EMBEDDED THEREIN AND METHOD...
- Publication number 20120292089
- Publication date Nov 22, 2012
- Unimicron Technology Corp.
- Chung-Cheng LIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE EMBEDDED WITH SEMICONDUCTOR CHIPS
- Publication number 20090200658
- Publication date Aug 13, 2009
- Phoenix Precision Technology Corporation
- Shih Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack structure of circuit boards embedded with semiconductor chips
- Publication number 20090091903
- Publication date Apr 9, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING...
- Publication number 20090032930
- Publication date Feb 5, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of packaging substrate having capacitor embedded therein...
- Publication number 20080308309
- Publication date Dec 18, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20080237832
- Publication date Oct 2, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20080237833
- Publication date Oct 2, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20080237831
- Publication date Oct 2, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package module
- Publication number 20080230892
- Publication date Sep 25, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure and stacked package module using the same
- Publication number 20080224295
- Publication date Sep 18, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chung-Cheng Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packaging substrate structure with capacitor embedded...
- Publication number 20080217739
- Publication date Sep 11, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board structure with capacitors embedded therein and method...
- Publication number 20080210460
- Publication date Sep 4, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier plate structure havign a chip embedded therein and the manu...
- Publication number 20080185704
- Publication date Aug 7, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plate structure having chip embedded therein and the manufacturing...
- Publication number 20080164597
- Publication date Jul 10, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier structure for semiconductor chip and method for manufacturi...
- Publication number 20080116562
- Publication date May 22, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chung-Cheng Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Assembly Having Passive Component and Stack Structure...
- Publication number 20080047740
- Publication date Feb 28, 2008
- Phoenix Precision Technology Corporation
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plate structure having chip embedded therein and the manufacturing...
- Publication number 20080029872
- Publication date Feb 7, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board structure with capacitors embedded therein and method...
- Publication number 20080030965
- Publication date Feb 7, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED WITH SEMICONDUCTOR CHIP AND STACK STRUCTURE OF THE...
- Publication number 20070284717
- Publication date Dec 13, 2007
- Phoenix Precision Technology Corporation
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACK STRUCTURE OF CIRCUIT BOARD WITH SEMICONDUCTOR COMPONENT EMBED...
- Publication number 20070278644
- Publication date Dec 6, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR F...
- Publication number 20070241444
- Publication date Oct 18, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure embedded with semiconductor chips
- Publication number 20070181995
- Publication date Aug 9, 2007
- Shih Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Structure Having Capacitor Array and Embedded Electro...
- Publication number 20070147014
- Publication date Jun 28, 2007
- Phoenix Precision Technology Corporation
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with electroless plating metal connecting laye...
- Publication number 20070085205
- Publication date Apr 19, 2007
- Shang-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK STRUCTURE OF CARRIER BOARDS EMBEDDED WITH SEMICONDUCTOR COMPO...
- Publication number 20070084628
- Publication date Apr 19, 2007
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack Structure of Carrier Board Embedded with Semiconductor Compon...
- Publication number 20070085188
- Publication date Apr 19, 2007
- Phoenix Precision Technology Corporation
- Chia Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer structure with electroless plating metal connecting layer and...
- Publication number 20070087547
- Publication date Apr 19, 2007
- Shang Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for releasing stress of embedded chip and chip embedded stru...
- Publication number 20050239269
- Publication date Oct 27, 2005
- Phoenix Precision Technology Corporation
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Cheng LIEN

Person

Patents Grantslast 30 patents

Communication device and communication method

Circuit board structure with capacitors embedded therein

Method for fabricating circuit board structure with capacitors embe...

Circuit board structure embedded with semiconductor chips

Stack structure of circuit boards embedded with semiconductor chips

Circuit board structure having capacitor array and embedded electro...

Stack structure of circuit board with semiconductor component embed...

Carrier structure for semiconductor chip and method for manufacturi...

Plate structure having chip embedded therein and the manufacturing...

Stack structure of carrier board embedded with semiconductor compon...

Stack structure of carrier boards embedded with semiconductor compo...

Patents Applicationslast 30 patents

COMMUNICATION DEVICE AND COMMUNICATION METHOD

CIRCUIT BOARD STRUCTURE WITH CAPACITORS EMBEDDED THEREIN AND METHOD...

CIRCUIT BOARD STRUCTURE EMBEDDED WITH SEMICONDUCTOR CHIPS

Stack structure of circuit boards embedded with semiconductor chips

PACKAGING SUBSTRATE HAVING CHIP EMBEDDED THEREIN AND MANUFACTURING...

Structure of packaging substrate having capacitor embedded therein...

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

Chip package module

Package structure and stacked package module using the same

Semiconductor packaging substrate structure with capacitor embedded...

Circuit board structure with capacitors embedded therein and method...

Carrier plate structure havign a chip embedded therein and the manu...

Plate structure having chip embedded therein and the manufacturing...

Carrier structure for semiconductor chip and method for manufacturi...

Circuit Board Assembly Having Passive Component and Stack Structure...

Plate structure having chip embedded therein and the manufacturing...

Circuit board structure with capacitors embedded therein and method...

DEVICE EMBEDDED WITH SEMICONDUCTOR CHIP AND STACK STRUCTURE OF THE...

STACK STRUCTURE OF CIRCUIT BOARD WITH SEMICONDUCTOR COMPONENT EMBED...

CARRIER BOARD STRUCTURE WITH CHIP EMBEDDED THEREIN AND METHOD FOR F...

Circuit board structure embedded with semiconductor chips

Circuit Board Structure Having Capacitor Array and Embedded Electro...

Semiconductor device with electroless plating metal connecting laye...

STACK STRUCTURE OF CARRIER BOARDS EMBEDDED WITH SEMICONDUCTOR COMPO...

Stack Structure of Carrier Board Embedded with Semiconductor Compon...

Wafer structure with electroless plating metal connecting layer and...

Method for releasing stress of embedded chip and chip embedded stru...