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Gaius Gillman Fountain JR.
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Youngsville, NC, US
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Patents Grants
last 30 patents
Information
Patent Grant
Dimension compensation control for directly bonded structures
Patent number
12,009,338
Issue date
Jun 11, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating surface damage of probe pads in preparation for direct b...
Patent number
11,978,681
Issue date
May 7, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
Patent number
11,967,575
Issue date
Apr 23, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for bonding elements including conductive interface feat...
Patent number
11,955,393
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal pads over TSV
Patent number
11,955,445
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct bonded stack structures for increased reliability and improv...
Patent number
11,955,463
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for processing devices
Patent number
11,855,064
Issue date
Dec 26, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
DBI to SI bonding for simplified handle wafer
Patent number
11,791,307
Issue date
Oct 17, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Chandrasekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures
Patent number
11,756,880
Issue date
Sep 12, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
TSV as pad
Patent number
11,749,645
Issue date
Sep 5, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for joining dissimilar materials in microelectronics
Patent number
11,664,357
Issue date
May 30, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processed stacked dies
Patent number
11,652,083
Issue date
May 16, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous annealing method
Patent number
11,631,586
Issue date
Apr 18, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical polishing for hybrid bonding
Patent number
11,552,041
Issue date
Jan 10, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
11,515,202
Issue date
Nov 29, 2022
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Large metal pads over TSV
Patent number
11,393,779
Issue date
Jul 19, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating surface damage of probe pads in preparation for direct b...
Patent number
11,355,404
Issue date
Jun 7, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
Patent number
11,296,044
Issue date
Apr 5, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct bonded stack structures for increased reliability and improv...
Patent number
11,296,053
Issue date
Apr 5, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
11,289,372
Issue date
Mar 29, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures
Patent number
11,158,573
Issue date
Oct 26, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for processing devices
Patent number
11,037,919
Issue date
Jun 15, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
11,011,418
Issue date
May 18, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
Patent number
11,011,494
Issue date
May 18, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structures
Patent number
11,004,757
Issue date
May 11, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
DBI to Si bonding for simplified handle wafer
Patent number
10,964,664
Issue date
Mar 30, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Chandrasekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for efficient transfer of semiconductor elements
Patent number
10,896,902
Issue date
Jan 19, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processed stacked dies
Patent number
10,879,212
Issue date
Dec 29, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical mechanical polishing for hybrid bonding
Patent number
10,840,205
Issue date
Nov 17, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous device
Patent number
10,777,533
Issue date
Sep 15, 2020
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...
Publication number
20240213105
Publication date
Jun 27, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
Publication number
20240203948
Publication date
Jun 20, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL PADS OVER TSV
Publication number
20240194625
Publication date
Jun 13, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
Publication number
20240186284
Publication date
Jun 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Chandrasekhar Mandalapu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TSV AS PAD
Publication number
20240088101
Publication date
Mar 14, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURES
Publication number
20240047344
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-SUBSTRATE VIAS WITH METAL PLANE LAYERS AND METHODS OF MANUF...
Publication number
20230352369
Publication date
Nov 2, 2023
INVENSAS BONDING TECHNOLOGIES, INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSED STACKED DIES
Publication number
20230282610
Publication date
Sep 7, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES
Publication number
20230268300
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
Publication number
20230268308
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
Publication number
20230253383
Publication date
Aug 10, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECTLY BONDED FRAME WAFERS
Publication number
20230207402
Publication date
Jun 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
Publication number
20230207474
Publication date
Jun 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
Publication number
20230207322
Publication date
Jun 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUSES AND METHODS FOR DIE BOND CONTROL
Publication number
20230207514
Publication date
Jun 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...
Publication number
20230197453
Publication date
Jun 22, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
Publication number
20230187398
Publication date
Jun 15, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian GAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DISTRIBUTION FOR STACKED ELECTRONIC DEVICES
Publication number
20230187412
Publication date
Jun 15, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDING METHODS AND STRUCTURES
Publication number
20230140107
Publication date
May 4, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED STRUCTURES WITH CAPACITIVE COUPLING CONNECTIONS
Publication number
20230125395
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMP...
Publication number
20230118156
Publication date
Apr 20, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INDUCTORS IN MULTI-DIE STACKING
Publication number
20230123423
Publication date
Apr 20, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELEMENT WITH ROUTING STRUCTURE IN BONDING LAYER
Publication number
20230005850
Publication date
Jan 5, 2023
INVENSAS BONDING TECHNOLOGIES, INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDING AND DEBONDING OF CARRIER
Publication number
20220320036
Publication date
Oct 6, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDING AND DEBONDING OF CARRIER
Publication number
20220319901
Publication date
Oct 6, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Dominik Suwito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL PADS OVER TSV
Publication number
20220302058
Publication date
Sep 22, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian GAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
Publication number
20220293567
Publication date
Sep 15, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MITIGATING SURFACE DAMAGE OF PROBE PADS IN PREPARATION FOR DIRECT B...
Publication number
20220285236
Publication date
Sep 8, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
Publication number
20220246564
Publication date
Aug 4, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Guilian GAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES WITH THROUGH-SUBSTRATE VIAS AND METHODS FOR FORMING THE...
Publication number
20220246497
Publication date
Aug 4, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Gaius Gillman Fountain
H01 - BASIC ELECTRIC ELEMENTS