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H01L2924/1206

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1206Inductor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with patterned ground shielding
- Patent number 12,148,694
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributing on chip inductors for monolithic voltage regulation
- Patent number 12,094,841
- Issue date Sep 17, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 12,062,623
- Issue date Aug 13, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 12,062,641
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,923,313
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,854,969
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of driving arrays of diodes
- Patent number 11,769,987
- Issue date Sep 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jean-Paul Anna Joseph Eggermont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing electronic module
- Patent number 11,756,906
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated voltage regulator
- Patent number 11,715,691
- Issue date Aug 1, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,710,704
- Issue date Jul 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package utilizing molded interposer
- Patent number 11,710,693
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 11,658,157
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump-metallization structure and redistribution layer design...
- Patent number 11,631,658
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 11,621,230
- Issue date Apr 4, 2023
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral inductors
- Patent number 11,616,014
- Issue date Mar 28, 2023
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched power stage with integrated passive components
- Patent number 11,605,580
- Issue date Mar 14, 2023
- CHAOYANG SEMICONDUCTOR (SHANGHAI) CO., LTD
- Taner Dosluoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 11,587,894
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone radio frequency transistor amplifiers
- Patent number 11,533,024
- Issue date Dec 20, 2022
- Wolfspeed, Inc.
- Kwangmo Chris Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die integrated with package voltage regulators
- Patent number 11,515,289
- Issue date Nov 29, 2022
- QUALCOMM Incorporated
- Bharani Chava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection element
- Patent number 11,444,078
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Noriyuki Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming thereof
- Patent number 11,410,927
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION
- Publication number 20240404966
- Publication date Dec 5, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING
- Publication number 20240387363
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312969
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312877
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND F...
- Publication number 20240290766
- Publication date Aug 29, 2024
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Solid State Circuit Breaker Structure
- Publication number 20240291478
- Publication date Aug 29, 2024
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...
- Publication number 20240282723
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE
- Publication number 20240258212
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED CHIPLET
- Publication number 20240234304
- Publication date Jul 11, 2024
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant KULKARNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS
- Publication number 20240213151
- Publication date Jun 27, 2024
- Western Digital Technologies, Inc.
- John T. Contreras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY DEVICE PACKAGES
- Publication number 20240213188
- Publication date Jun 27, 2024
- Analog Devices, Inc.
- Santosh Anil Kudtarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
- Publication number 20240113070
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- CHINTAN BUCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THE...
- Publication number 20240079354
- Publication date Mar 7, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Yingwei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240055360
- Publication date Feb 15, 2024
- FARADAY SEMI, INC.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240047385
- Publication date Feb 8, 2024
- Huawei Technologies Co., Ltd
- Kehan Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE
- Publication number 20240030166
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20240030165
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Kiyoshi AIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411282
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF DRIVING ARRAYS OF DIODES
- Publication number 20230387658
- Publication date Nov 30, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jean-Paul Anna Joseph EGGERMONT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH COIL BELOW AND OVERLAPPING A PAD
- Publication number 20230343814
- Publication date Oct 26, 2023
- NVIDIA Corporation
- Jedrzej Wyczynski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...
- Publication number 20230299052
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICE WITHOUT SILICON HANDLE SUBSTRATE FOR ENHANCED THERMAL AND...
- Publication number 20230260921
- Publication date Aug 17, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
- Publication number 20230253384
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package and method of fabricating the same

Semiconductor device with patterned ground shielding

Distributing on chip inductors for monolithic voltage regulation

Semiconductor device and method to minimize stress on stack via

RF device without silicon handle substrate for enhanced thermal and...

Integrated circuit including a first semiconductor wafer and a seco...

Structure and method of forming a joint assembly

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor package and manufacturing method of the same

Structure and method for fabricating a computing system with an int...

RF device without silicon handle substrate for enhanced thermal and...

Semiconductor structure and method for forming thereof

Wire bond wires for interference shielding

Methods and systems of driving arrays of diodes

Electronic module and method of manufacturing electronic module

Integrated circuit package with integrated voltage regulator

RF device without silicon handle substrate for enhanced thermal and...

Wafer level package utilizing molded interposer

Structure and method for fabricating a computing system with an int...

Integrated circuit including a first semiconductor wafer and a seco...

Under-bump-metallization structure and redistribution layer design...

Electrical devices and methods of manufacture

Peripheral inductors

Switched power stage with integrated passive components

Package and method of fabricating the same

Multi-zone radio frequency transistor amplifiers

Stacked die integrated with package voltage regulators

Wire bond wires for interference shielding

ESD protection element

Semiconductor structure and method for forming thereof

Patents Applicationslast 30 patents

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION

SEMICONDUCTOR DEVICE WITH PATTERNED GROUND SHIELDING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND F...

Enhanced Solid State Circuit Breaker Structure

Structure and Method of Forming a Joint Assembly

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...

SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE

Structure and Method for Fabricating a Computing System with an Int...

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS

HIGH FREQUENCY DEVICE PACKAGES

INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...

SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THE...

ELECTRICAL DEVICES AND METHODS OF MANUFACTURE

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

FILTERING STRUCTURE AND ELECTRONIC DEVICE

RADIO-FREQUENCY MODULE

HIGH-FREQUENCY MODULE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS AND SYSTEMS OF DRIVING ARRAYS OF DIODES

INTEGRATED CIRCUIT WITH COIL BELOW AND OVERLAPPING A PAD

Structure and Method for Fabricating a Computing System with an Int...

INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...

RF DEVICE WITHOUT SILICON HANDLE SUBSTRATE FOR ENHANCED THERMAL AND...

UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...