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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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Patent Grant
Semiconductor package and manufacturing method of the same
Patent number
11,967,553
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for fabricating a computing system with an int...
Patent number
11,967,528
Issue date
Apr 23, 2024
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
Patent number
11,923,313
Issue date
Mar 5, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming thereof
Patent number
11,854,969
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
11,810,867
Issue date
Nov 7, 2023
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods and systems of driving arrays of diodes
Patent number
11,769,987
Issue date
Sep 26, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jean-Paul Anna Joseph Eggermont
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and method of manufacturing electronic module
Patent number
11,756,906
Issue date
Sep 12, 2023
Murata Manufacturing Co., Ltd.
Takashi Iwamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit package with integrated voltage regulator
Patent number
11,715,691
Issue date
Aug 1, 2023
Advanced Micro Devices, Inc.
Milind S. Bhagavat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
Patent number
11,710,704
Issue date
Jul 25, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer level package utilizing molded interposer
Patent number
11,710,693
Issue date
Jul 25, 2023
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structure and method for fabricating a computing system with an int...
Patent number
11,670,548
Issue date
Jun 6, 2023
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
Patent number
11,658,157
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Lin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under-bump-metallization structure and redistribution layer design...
Patent number
11,631,658
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical devices and methods of manufacture
Patent number
11,621,230
Issue date
Apr 4, 2023
Faraday Semi, Inc.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Peripheral inductors
Patent number
11,616,014
Issue date
Mar 28, 2023
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Switched power stage with integrated passive components
Patent number
11,605,580
Issue date
Mar 14, 2023
CHAOYANG SEMICONDUCTOR (SHANGHAI) CO., LTD
Taner Dosluoglu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package and method of fabricating the same
Patent number
11,587,894
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-zone radio frequency transistor amplifiers
Patent number
11,533,024
Issue date
Dec 20, 2022
Wolfspeed, Inc.
Kwangmo Chris Lim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked die integrated with package voltage regulators
Patent number
11,515,289
Issue date
Nov 29, 2022
QUALCOMM Incorporated
Bharani Chava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
11,462,483
Issue date
Oct 4, 2022
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
ESD protection element
Patent number
11,444,078
Issue date
Sep 13, 2022
Murata Manufacturing Co., Ltd.
Noriyuki Ueki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method for forming thereof
Patent number
11,410,927
Issue date
Aug 9, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,387,157
Issue date
Jul 12, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
11,373,969
Issue date
Jun 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chi-Hsi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,355,405
Issue date
Jun 7, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of forming a joint assembly
Patent number
11,355,468
Issue date
Jun 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with patterned ground shielding
Patent number
11,355,432
Issue date
Jun 7, 2022
Taiwan Semiconductor Manufacturing Company Limited
Hsiao-Tsung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical communication apparatus
Patent number
11,342,318
Issue date
May 24, 2022
Nippon Telegraph and Telephone Corporation
Toshihiro Ito
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,322,420
Issue date
May 3, 2022
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor package having integrated inductor, resistor an...
Patent number
11,309,233
Issue date
Apr 19, 2022
ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
Xiaotian Zhang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
Publication number
20240113070
Publication date
Apr 4, 2024
ADVANCED MICRO DEVICES, INC.
CHINTAN BUCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICE, AND PRODUCTION METHOD THE...
Publication number
20240079354
Publication date
Mar 7, 2024
BOE TECHNOLOGY GROUP CO., LTD.
Yingwei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20240055360
Publication date
Feb 15, 2024
FARADAY SEMI, INC.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
Publication number
20240055468
Publication date
Feb 15, 2024
TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
Publication number
20240047385
Publication date
Feb 8, 2024
Huawei Technologies Co., Ltd
Kehan Sui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIO-FREQUENCY MODULE
Publication number
20240030166
Publication date
Jan 25, 2024
Murata Manufacturing Co., Ltd.
Hiromichi KITAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCY MODULE
Publication number
20240030165
Publication date
Jan 25, 2024
Murata Manufacturing Co., Ltd.
Kiyoshi AIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230411282
Publication date
Dec 21, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND SYSTEMS OF DRIVING ARRAYS OF DIODES
Publication number
20230387658
Publication date
Nov 30, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jean-Paul Anna Joseph EGGERMONT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WITH COIL BELOW AND OVERLAPPING A PAD
Publication number
20230343814
Publication date
Oct 26, 2023
NVIDIA Corporation
Jedrzej Wyczynski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method for Fabricating a Computing System with an Int...
Publication number
20230335440
Publication date
Oct 19, 2023
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURIN...
Publication number
20230299052
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Lin CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF DEVICE WITHOUT SILICON HANDLE SUBSTRATE FOR ENHANCED THERMAL AND...
Publication number
20230260921
Publication date
Aug 17, 2023
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
Publication number
20230253384
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230187391
Publication date
Jun 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20230084150
Publication date
Mar 16, 2023
Fuji Electric Co., Ltd.
Masayoshi NAKAZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20230059375
Publication date
Feb 23, 2023
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
Publication number
20220367351
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
Publication number
20220367352
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20220302069
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20220262752
Publication date
Aug 18, 2022
UNITED MICROELECTRONICS CORPORATION
Chien-Ming Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20220216146
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing company Ltd.
MING-FA CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THEREOF
Publication number
20220165665
Publication date
May 26, 2022
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE INTEGRATED WITH PACKAGE VOLTAGE REGULATORS
Publication number
20220077109
Publication date
Mar 10, 2022
QUALCOMM Incorporated
Bharani CHAVA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20220068823
Publication date
Mar 3, 2022
FARADAY SEMI, INC.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20220013480
Publication date
Jan 13, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
Publication number
20210408976
Publication date
Dec 30, 2021
Cree, Inc.
Kwangmo Chris Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE AND METHOD OF MANUFACTURING ELECTRONIC MODULE
Publication number
20210366849
Publication date
Nov 25, 2021
Murata Manufacturing Co., Ltd.
Takashi IWAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES
Publication number
20210335718
Publication date
Oct 28, 2021
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS