3286340

Information

• Patent Grant
• 3286340

• References
• Source

• Patent Number

  3,286,340

• Date Filed

  Not available

• Date Issued

  Tuesday, November 22, 1966
  58 years ago

• CPC

  • H01L24/85 - using a wire connector
  • H01L24/49 - of a plurality of wire connectors
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L24/45 - of an individual wire connector
  • H01L2224/45015 - being circular
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48091 - Arched
  • H01L2224/49 - of a plurality of wire connectors
  • H01L2224/78301 - Capillary
  • H01L2224/85099 - Ambient temperature
  • H01L2224/85201 - Compression bonding
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01058 - Cerium [Ce]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • Y10S228/902 - using flame

• US Classifications

  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process