3621565

Information

• Patent Grant
• 3621565

• References
• Source

• Patent Number

  3,621,565

• Date Filed

  Not available

• Date Issued

  Tuesday, November 23, 1971
  54 years ago

• CPC

  • H01L21/6835 - using temporarily an auxiliary support
  • H01L21/563 - Encapsulation of active face of flip-chip device
  • H01L24/81 - using a bump connector
  • H01L2221/68354 - used to support diced chips prior to mounting
  • H01L2221/68359 - used as a support during manufacture of interconnect decals or build up layers
  • H01L2221/68363 - used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
  • H01L2224/16 - of an individual bump connector
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/73203 - Bump and layer connectors
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01049 - Indium [In]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H01L2924/07802 - not being an ohmic electrical conductor
  • Y10S148/051 - Etching
  • Y10S148/065 - Gp III-V generic compounds-processing
  • Y10S148/135 - Removal of substrate
  • Y10S257/912 - Charge transfer device using both electron and hole signal carriers
  • Y10S438/977 - Thinning or removal of substrate
  • Y10T29/4981 - Utilizing transitory attached element or associated separate material

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 029 - Metal working
  • 148 - Metal treatment
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 257 - Active solid-state devices