3662454

Information

• Patent Grant
• 3662454

• References
• Source

• Patent Number

  3,662,454

• Date Filed

  Not available

• Date Issued

  Tuesday, May 16, 1972
  52 years ago

• CPC

  • H01L24/48 - of an individual wire connector
  • B23K20/10 - making use of vibrations
  • B23K35/007 - at least one of the workpieces being of copper or another noble metal
  • H01L24/45 - of an individual wire connector
  • H01L24/85 - using a wire connector
  • H01L2224/45139 - Silver (Ag) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/45147 - Copper (Cu) as principal constituent
  • H01L2224/45565 - Single coating layer
  • H01L2224/45623 - Magnesium (Mg) as principal constituent
  • H01L2224/45624 - Aluminium (Al) as principal constituent
  • H01L2224/45655 - Nickel (Ni) as principal constituent
  • H01L2224/45657 - Cobalt (Co) as principal constituent
  • H01L2224/4566 - Iron (Fe) as principal constituent
  • H01L2224/45664 - Palladium (Pd) as principal constituent
  • H01L2224/4847 - the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/85205 - Ultrasonic bonding
  • H01L2924/00011 - Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
  • H01L2924/01004 - Beryllium [Be]
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01012 - Magnesium [Mg]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01046 - Palladium [Pd]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H05K3/328 - by welding
  • Y10S228/904 - Wire bonding

• US Classifications

  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices