Claims
- 1. An apparatus for electroplating a metal onto a substrate plating surface, comprising:a) an enclosure having an anode disposed at an upper portion thereof and a substrate support member disposed at a bottom portion thereof, the support member capable of holding a substrate with the substrate plating surface face-up and rotating the substrate during an electroplating process; b) a cathode clamp ring having an annular contact portion to electrically contact a peripheral portion of the substrate plating surface; c) a catch cup extending from an interior surface of the enclosure to a bottom surface of the cathode clamp ring; d) one or more rinse spray spouts disposed below the catch cup; and e) a rinse agent reservoir; and f) a rinse catch cup disposed below the rinse spray spouts, the rinse catch cup extending from the inner surface of the enclosure and forming an inner terminus that allows movement of the substrate support member therethrough.
- 2. The apparatus of claim 1, wherein the rinse catch cup includes a rinse drain.
- 3. The apparatus of claim 1, further comprising an outlet connected to the rinse drain.
- 4. The apparatus of claim 3, further comprising a purifier connected between the outlet and the rinse agent reservoir.
- 5. The apparatus of claim 1, wherein the rinse catch cup is disposed within the enclosure below the catch cup.
- 6. The apparatus of claim 1, wherein the substrate support member is vertically moveable within the enclosure.
CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation of U.S. patent application Ser. No. 09/294,240, filed on Apr. 19, 1999 now U.S. Pat. No. 6,416,647, which claims the benefit of U.S. Provisional Application Serial No. 60/082,494, filed on Apr. 21, 1998. Each of the aforementioned related patent applications is incorporated by reference herein.
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