Claims
- 1. A method of making a semiconductor package device comprising the steps of:
- attaching the active face of a semiconductor integrated circuit to a chip-on-lead leadframe having leadfingers;
- applying a polyimide coating to the backside of the semiconductor integrated circuit; and
- encapsulating the semiconductor integrated circuit and the chip-on-lead leadframe with a material leaving the leadfingers exposed.
- 2. A method of making a semiconductor package device comprising the steps of:
- attaching the active face of a semiconductor integrated circuit to a tabpak tape having leadfingers;
- applying a polyimide coating to the backside of the semiconductor integrated circuit; and
- encapsulating the semiconductor integrated circuit and the tabpak tape with a material leaving the leadfingers exposed.
- 3. A method of making a semiconductor package device comprising the steps of:
- attaching the active face of a semiconductor integrated circuit to a flip-chip leadframe having leadfingers;
- applying a polyimide coating to the backside of the semiconductor integrated circuit; and
- encapsulating the semiconductor integrated circuit and the flip-chip leadframe with a material leaving the leadfingers exposed.
- 4. The method of claim 1 wherein the material is plastic.
- 5. The method of claim 2 wherein the material is plastic.
- 6. The method of claim 3 wherein the material is plastic.
Parent Case Info
This is a division of application Ser. No. 07/455,210, filed Dec. 22, 1989, now U.S. Pat. No. 5,313,102.
US Referenced Citations (5)
Foreign Referenced Citations (1)
Number |
Date |
Country |
63-179554 |
Jul 1988 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
455210 |
Dec 1989 |
|