Patent Application
20100230826
1. Technical Field
The present disclosure relates to semiconductor packages, and more particularly to an integrated circuit (IC) package assembly and packaging method.
2. Description of Related Art
Due to rapid developments in electronic technology, electronic products have been drastically reduced in size, resulting in a requirement for small integrated circuits (ICs) for application therein. In response, IC packages have been reduced in size.
However, because the width and length of the bonding pad 520 are greater than the width and length of the IC 530, the adhesive 550 is prone to overflow onto the plurality of connecting pads 532 of the IC 530, inflicting damage thereon.
The substrate 10 is a printed circuit board, in one example, and includes a plurality of golden fingers 12 arranged on a surface thereof. In the illustrated embodiment, the plurality of golden fingers 12 are plated on the surface of the substrate 10.
The bonding pad 20 is integrally formed with the substrate 10. A thickness of the bonding pad 20 is greater than a thickness of each of the plurality of golden fingers 12, and a width and a length of the bonding pad 20 are less than a width and a length of the IC 30. In the illustrated embodiment, the bonding pad 20 is conductive, and plated on the surface of the substrate 10. That is, the bonding pad 20 and the plurality of golden fingers 12 are plated on the surface of the substrate 10, conserving assembly and disassembly cost of the bonding pad 20.
The IC 30 includes a plurality of connecting pads 32. The plurality of bonding wires 40 electrically connect the plurality of connecting pads 32 to the plurality of golden fingers 12 so that the IC 30 is electrically connected to the substrate 10. In the illustrated embodiment, a thickness of the IC 30 is less than or equal to 50 μm.
The IC 30 is fixed on the bonding pad 20 by the adhesive 50. In the illustrated embodiment, the adhesive 50 may be an epoxy resin to further provide improved heat dissipation of the IC 30.
The IC package assembly 100 further includes an encapsulation 60 disposed on the substrate 10 to encapsulate the IC 30, the bonding pad 20, the plurality of bonding wires 40, and the plurality of golden fingers 12 therein.
Because the width and length of the bonding pad 20 are less than the width and length of the IC 30, no overflow of the adhesive 50 affects the plurality of connecting pads 32 of the IC 30, thus avoiding damage thereto.
Because the bonding pad 20 is thicker than each of the plurality of golden fingers 12 and is not fixed to the substrate 10 by the adhesive 50, substantially less adhesive 50 flows onto the plurality of golden fingers 12, thus further avoiding damage thereto.
Because the bonding pad 20 is plated on the surface of the substrate 10, the bonding pad 20 cannot separate from the substrate 10 when the IC package assembly 100 undergoes a reflow procedure.
In block S301, the bonding pad 20 or 220 is integrally formed with the substrate 10. In one example, the bonding pad 20 or 220 is plated on the substrate 100.
In block S303, the IC 30 or 230 is fixed on the bonding pad 20 or 220 by the adhesive 50 or 250.
In block S305, the plurality of bonding wires 40 electrically connect the plurality of connecting pads 32 and the plurality of golden fingers 12.
In block S307, the encapsulation 60 encapsulates the IC 30, the bonding pad 20, the plurality of connecting pads 32, and the plurality of bonding wires 40 therein.
While various embodiments and methods of the present disclosure have been described above, it should be understood that they have been presented by way of example only and not by way of limitation. Thus the breadth and scope of the present disclosure should not be limited by the above-described embodiments, but should be defined only in accordance with the following claims and their equivalents.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200910106126.6 | Mar 2009 | CN | national |
