Claims
- 1. A memory assembly, comprising:
a substrate having magnetic shielding; a magnetic random access memory die supported by the substrate; and an encapsulation matrix having magnetic shielding and being disposed over the magnetic random access memory die.
- 2. The memory assembly of claim 1, wherein the encapsulation matrix at least substantially encloses the magnetic random access memory die.
- 3. The memory assembly of claim 1, wherein the substrate incorporates an internal layer of magnetic shielding.
- 4. The memory assembly of claim 1, wherein the encapsulation matrix comprises magnetic shielding particles embedded within the encapsulation matrix.
- 5. The memory assembly of claim 1, wherein the substrate comprises a circuit structure.
- 6. The memory assembly of claim 5, wherein the encapsulation matrix is disposed over a plurality of magnetic random access memory dies.
- 7. The memory assembly of claim 1, wherein the magnetic random access memory die is directly electrically connected to the substrate using a flip-chip configuration.
- 8. The memory assembly of claim 1, wherein the magnetic random access memory die comprises input/outputs that are electrically connected to the substrate via one or more wire interbonds.
- 9. The memory assembly of claim 1, wherein the memory assembly is configured for electrical connection to an additional substrate.
- 10. The memory assembly of claim 9, wherein the electrical connection to the additional substrate occurs via a plurality of solder connections.
- 11. An electronic device, comprising:
a magnetic memory assembly that comprises
a substrate; a magnetic random access memory die supported by the substrate; and an encapsulation matrix disposed over the magnetic random access memory die and supported by the substrate; wherein both the substrate and the encapsulation matrix incorporate magnetic shielding.
- 12. The electronic device of claim 11, wherein the magnetic memory assembly comprises a removable package.
- 13. The electronic device of claim 12, wherein the removable package comprises a memory card.
- 14. A method of manufacturing a magnetic random access memory assembly, the method comprising:
providing a substrate that incorporates magnetic shielding; attaching a magnetic memory die to the substrate; and applying a magnetically shielding material onto the magnetic random access memory die.
- 15. The method of claim 14, wherein providing the substrate comprises internally incorporating the magnetic shielding in the substrate.
- 16. The method of claim 14, wherein applying the magnetically shielding material comprises at least substantially enclosing the magnetic random access memory die in the material.
- 17. The method of claim 14, wherein applying the material comprises injection molding the material onto the magnetic random access memory die.
- 18. The method of claim 14, wherein applying the material comprises applying the material directly onto the magnetic random access memory die as a liquid or semi-liquid.
- 19. The method of claim 18, further comprising curing the material.
- 20. A memory, comprising
means for storing magnetic random access memory; means for supporting a magnetic random access memory means; means for encapsulating the magnetic random access memory means; magnetic shielding means disposed in the supporting means; and magnetic shielding means disposed in the encapsulating means.
Parent Case Info
[0001] This application is a continuation-in-part of U.S. patent application Ser. No. 10/358,770, filed Feb. 5, 2003 of Andrew M. Spencer, Connie Lemus and Colin Stobbs entitled MAGNETIC SHIELDING FOR MAGNETIC RANDOM ACCESS MEMORY CARD, hereby incorporated by reference.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
10358770 |
Feb 2003 |
US |
Child |
10631404 |
Jul 2003 |
US |