Claims
- 1. A method of underfilling a gap between a component and a component carrier to encapsulate a plurality of electrical connections extending therebetween, one of the component carrier and the component including a passageway that communicates with the gap, the method comprising:
heating the component and the component carrier; introducing underfill material into the passageway; and moving underfill material from the passageway into the gap for encapsulating the plurality of electrical connections.
- 2. The method of claim 1 wherein introducing underfill material further comprises:
filling at least a portion of the passageway with underfill material before significant movement of underfill material into the gap.
- 3. The method of claim 1 wherein the passageway is located at a geometrical center of the one of the component carrier and the component.
- 4. The method of claim 1 wherein the passageway is offset from a geometrical center of the one of the component carrier and the component.
- 5. The method of claim 1 wherein the component and the component carrier are heated before the underfill material is introduced into the passageway, and the method further comprises:
maintaining the component at a substantially constant temperature until the plurality of electrical connections are encapsulated by the encapsulating material.
- 6. The method of claim 1 wherein heating the component and the component carrier is performed simultaneously with introducing underfill material.
- 7. The method of claim 1 further comprising:
increasing a temperature of the component and component carrier to form a fillet about an outer peripheral edge of the component.
- 8. The method of claim 1 wherein a volumetric capacity of the passageway is less than a volume of underfill material required to underfill the gap.
- 9. The method of claim 8 further comprising:
repeating the steps of introducing and moving until the gap is substantially filled with underfill material.
- 10. The method of claim 8 further comprising:
placing a flow control barrier about the passageway before the underfill material is introduced into the passageway for increasing the volumetric capacity of the passageway.
- 11. The method of claim 1 further comprising:
placing a flow control barrier about the passageway before the underfill material is introduced into the passageway.
- 12. The method of claim 11 further comprising:
dispensing the flow control barrier about the passageway.
- 13. The method of claim 1 wherein introducing the underfill material further comprises:
dispensing the underfill material in a liquid-phase into the passageway.
- 14. The method of claim 1 wherein introducing the underfill material further comprises:
placing a solid-phase volume of underfill material into the passageway that converts into a liquid phase during heating.
- 15. The method of claim 1 wherein heating the component and component carrier further comprises:
transferring heat energy directly to the component carrier from a heat source.
- 16. The method of claim 1 wherein heating the component and component carrier further comprises:
transferring heat energy directly to the component from a heat source.
- 17. The method of claim 1 further comprising a plurality of passageways, and introducing the underfill material further comprises:
dispensing the underfill material into each of the plurality of passageways.
- 18. The method of claim 17, wherein the plurality of passageways are symmetrically arranged about a geometrical center of the one of the component and the component carrier.
- 19. The method of claim 1 wherein the passageway is defined in the component carrier.
- 20. The method of claim 1 wherein the passageway includes first and second bores that differ in diameter.
- 21. The method of claim 20 wherein the first bore is defined by a flow control barrier, and further comprising:
placing the flow control barrier about the second bore before the underfill material is introduced into the passageway.
- 22. The method of claim 1 wherein the passageway is tapered.
- 23. The method of claim 1 wherein the passageway is inclined relative to a planar surface of the one of the component and the component carrier defined at a boundary with the gap.
- 24. A method of underfilling a gap between a component and a component carrier to encapsulate a plurality of electrical connections extending therebetween, comprising:
positioning a dispenser relative to a passageway defined in one of the component carrier and the component that communicates with the gap; heating the component and the component carrier; introducing underfill material into the passageway; and moving underfill material from the passageway into the gap for encapsulating the plurality of electrical connections.
- 25. The method of claim 24 wherein introducing underfill material further comprises:
filling at least a portion of the passageway with underfill material before significant movement of underfill material into the gap.
- 26. The method of claim 24 wherein the passageway is located at a geometrical center of the one of the component carrier and the component.
- 27. The method of claim 24 wherein the passageway is offset from a geometrical center of the one of the component carrier and the component.
- 28. The method of claim 24 wherein the component and the component carrier are heated before the underfill material is introduced into the passageway, and the method further comprises:
maintaining the component at a substantially constant temperature until the plurality of electrical connections are encapsulated by the encapsulating material.
- 29. The method of claim 24 wherein heating the component and the component carrier is performed simultaneously with introducing underfill material.
- 30. The method of claim 24 further comprising:
increasing a temperature of the component and component carrier to form a fillet about an outer peripheral edge of the component.
- 31. The method of claim 24 wherein a volumetric capacity of the passageway is less than a volume of underfill material required to underfill the gap.
- 32. The method of claim 31 further comprising:
repeating the steps of introducing and moving until the gap is substantially filled with underfill material.
- 33. The method of claim 31 further comprising:
placing a flow control barrier about the passageway before the underfill material is introduced into the passageway for increasing the volumetric capacity of the passageway.
- 34. The method of claim 24 further comprising:
placing a flow control barrier about the passageway before the underfill material is introduced into the passageway.
- 35. The method of claim 34 further comprising:
dispensing the flow control barrier about the passageway.
- 36. The method of claim 24 wherein introducing the underfill material further comprises:
dispensing the underfill material in a liquid-phase into the passageway.
- 37. The method of claim 24 wherein introducing the underfill material further comprises:
placing a solid-phase volume of underfill material into the passageway that converts into a liquid phase during heating.
- 38. The method of claim 24 wherein heating the component and component carrier further comprises:
transferring heat energy directly to the component carrier from a heat source.
- 39. The method of claim 24 wherein heating the component and component carrier further comprises:
transferring heat energy directly to the component from a heat source.
- 40. The method of claim 24 further comprising a plurality of passageways, and introducing the underfill material further comprises:
dispensing the underfill material into each of the plurality of passageways.
- 41. The method of claim 40, wherein the plurality of passageways are symmetrically arranged about a geometrical center of the one of the component and the component carrier.
- 42. The method of claim 24 wherein the passageway is defined in the component carrier.
- 43. The method of claim 24 wherein the passageway includes first and second bores that differ in diameter.
- 44. The method of claim 43 wherein the first bore is defined by a flow control barrier, and further comprising:
placing the flow control barrier about the second bore before the underfill material is introduced into the passageway.
- 45. The method of claim 24 wherein the passageway is tapered.
- 46. The method of claim 24 wherein the passageway is inclined relative to a planar surface of the one of the component and the component carrier defined at a boundary with the gap.
- 47. The method of claim 24 further comprising:
attaching the component to the component carrier by forming the plurality of electrical connections.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional Application No. 60/443,029, filed Jan. 28, 2003, the disclosure of which is hereby incorporated by reference herein in its entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60443029 |
Jan 2003 |
US |