Claims
- 1. A method of hermetically sealing electronic parts, said method comprising bonding a base having semiconductor devices mounted thereon and a cap together via a solder, wherein said solder comprises from 78 wt % to less than 79.5 wt % Au, and a balance of Sn.
- 2. The method of claim 1, wherein said cap is plated with gold and with the use of said solder comprises from 78 wt % to less than 79 wt % Au, and a balance of Sn.
- 3. The method of claim 1, wherein the solder is adapted to form at least one solder layer of substantially uniform thickness.
- 4. The method of claim 1, wherein said solder, when bonded, comprises at least one Au—Sn alloy phase, wherein said Au—Sn alloy phase is substantially free of Au rich phases.
- 5. The method of claim 1, wherein said solder has a substantially uniform melting temperature.
- 6. The method of claim 1, wherein said solder, when bonded, is substantially free of Sn crystals.
- 7. The method of claim 1, wherein said solder comprises 78.5 wt % Au and 21.5 wt % Sn.
- 8. In a method of hermetically sealing an electronic part by bonding a base to a cap by a Au—Sn solder,the improvement comprising avoiding Au rich phases in the solder by using a solder consisting essentially of from 78 wt % to less than 79.5 wt % Au, and a balance of Sn.
- 9. The method of claim 8, wherein said cap is plated with gold,wherein Au rich phases in the solder are avoided by using a solder comprises from 78 wt % to less than 79 wt % Au, and a balance of Sn.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-358744 |
Nov 2000 |
JP |
|
Parent Case Info
This application is a national stage entry of International Application No. PCT/JP01/10302, filed Nov. 27, 2001 designating the U.S., which claims the benefit of Japanese Application No. 2000-358744, filed Nov. 27, 2001.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP01/10302 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO02/43141 |
5/30/2002 |
WO |
A |
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
3086086 |
Jul 2000 |
JP |
Non-Patent Literature Citations (1)
Entry |
Rao R. Tummala et al., BP, 1991. 03. 27, 10-9(a) (b) 11-16, p. 589. |