This application claims the benefit of U.S. provisional application Ser. No. 60/227,506, filed Aug. 24, 2000 and entitled “Bonded Microplatform Process For Technology Merging.”
This invention was made with government support under Contract No. F30602-97-2-0101 from DARPA. The government has certain rights in the invention.
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Number | Date | Country | |
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60/227506 | Aug 2000 | US |