Claims
- 1. A method of building a variety of complex high-performance integrated circuit devices from a small selection of standardizable components, comprising the steps of:
- (a) assembling plurality of substantially identical chip carriers adjacent to each other onto a common substrate to form a mosaic; wherein each of said carriers comprises:
- connection pads so arranged on the periphery of said carrier that each connection pad, except for those connection pads on the periphery of the mosaic, is immediately adjacent to a corresponding connection pad of another carrier of the mosaic; and
- a software-configurable integrated circuit chip mounted on said carrier; wherein:
- said chips, carriers, and mosaic are so configured as to allow each chip to selectively transmit and receive data through said connection pads to and from a chip on any adjacent carrier in said mosaic; and
- immediately adjacent ones of said connection pads are electrically connected to each other without the use of intervening wires or leads; and
- (b) configuring said chips by electronic signals to form a very large scale integrated circuit.
- 2. The method of claim 1, in which said chips are substantially identical.
- 3. The method of claim 2, in which said chips are selected from a small selection of standardized chips.
Parent Case Info
This is a divisional application of application Ser. No. 118,362, filed Nov. 6, 1987, which issued as U.S. Pat. No. 4,858,072 on Aug. 15, 1989.
Non-Patent Literature Citations (4)
Entry |
The Impact of Silicon interconnect Technology on the Design Engineer by C. C. Perkins Sr. et al. IEEE Conf. 1987, Electro /87 & Minr/Micro Northeast, pp. 36/2/ 1-4. |
Diserete Wafer Scale Integration by R. R. Johnson, Water Scale Integration, Proc of the IFIP WG 10.5 Workshop, pp. 345-352, 1986 ed by G. Sancier et al. |
Silicon-on-Silicon Hybrids are Coming Into Their Own by Jerry Lyman, Electronics May 1987, N60, p. 11 N47(2). |
Mosaic, A Modulas Architecture for VLSI System Circuits by J. Alves Conference: VLSI81, Very Large Scale Integration, Proceedings 8/18-21/81, pp. 53-61. |
Divisions (1)
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Number |
Date |
Country |
Parent |
118362 |
Nov 1987 |
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