Claims
- 1. A method of manufacturing a semiconductor device comprising the steps of:providing a semiconductor chip which is formed with semiconductor elements and a plurality of electrodes on its principal surface; providing a lead frame having a frame member, a die pad and a plurality of leads, the die pad and the leads being supported by the frame member; mounting the semiconductor chip through an adhesive onto the die pad; electrically connecting the plurality of electrodes with the plurality of leads by a plurality of conductive wires, respectively; encapsulating the semiconductor chip, the die pad, inner portions of the plurality of leads and the plurality or wires with a sealing body; and forming outer portions of the plurality of leads, which are protruding outwardly from the sealing body, into a gull-wing shape each having a first part which extends in a direction away from the sealing body, a second part which bends downwards from the first part, a third part which extend from the second part in a direction away from the sealing body, a first bent portion formed between the first part and the second part and a second bent portion formed between the second part and the third part, wherein each of the first bent portions has a width equal to or greater than a thickness of the lead, wherein each of the third parts has a width less than a thickness of the lead, wherein the plurality of leads are arrayed in a width direction of the leads, and wherein the lead frame comprises copper.
- 2. A method of manufacturing a semiconductor device according to claim 1, wherein the lead frame is comprised of alloy or copper.
- 3. A method of manufacturing a semiconductor device according to claim 2, wherein in the step of forming outer portions of the plurality of leads into a gull-wing shape, further bending the plurality of leads in a thickness direction of the leads to form the first bent portion with clamping of the first part of the leads.
- 4. A method of manufacturing a semiconductor device according to claim 2, wherein in the step of forming outer portions of the plurality of leads into a gull-wing shape, bending the plurality of leads in a thickness direction of the leads to form the first bend portion by bending punch with clamping of the first part of the leads.
- 5. A method of manufacturing a semiconductor device according to claim 4, further comprising a step of cutting off distal end parts of the third parts of the plurality of leads after the step of forming outer portions of the plurality of leads into a gull-wing shape.
- 6. A method of manufacturing a semiconductor device according to claim 4, wherein the semiconductor chip has a logic circuit.
- 7. A method of manufacturing a semiconductor device according to claim 5, wherein the semiconductor chip has a logic circuit.
- 8. A method of manufacturing a semiconductor device according to claim 7, wherein the second bent portion has a width being to or less than a thickness of the leads.
- 9. A method of manufacturing a semiconductor device according to claim 8, wherein the first bent portion is wider than the third part.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-366199 |
Dec 1998 |
JP |
|
Parent Case Info
This is a continuation application of U.S. Ser. No. 10/277,872, filed Oct. 23, 2002 now U.S. Pat. No. 6,553,657, which is continuation application of U.S. Ser. No. 10/190,575, filed Jul. 9, 2002 now U.S. Pat. No. 6,541,702, which is a continuation application of U.S. Ser. No. 09/457,292 filed Dec. 9, 1999, now U.S. Pat. No. 6,444,905.
US Referenced Citations (12)
Foreign Referenced Citations (5)
Number |
Date |
Country |
63-70548 |
Mar 1988 |
JP |
1-309359 |
Dec 1989 |
JP |
4-196573 |
Jul 1992 |
JP |
6-188350 |
Jul 1994 |
JP |
6-350003 |
Dec 1994 |
JP |
Continuations (3)
|
Number |
Date |
Country |
Parent |
10/277872 |
Oct 2002 |
US |
Child |
10/386552 |
|
US |
Parent |
10/190575 |
Jul 2002 |
US |
Child |
10/277872 |
|
US |
Parent |
09/457292 |
Dec 1999 |
US |
Child |
10/190575 |
|
US |