IBM Technical Disclosure Bulletin "Chip Packaging Structure With Enhanced Cooling", vol. 20, No. 5, Oct. 1977, pp. 1772-1773. |
IBM Technical Disclosure Bulletin "Modified Bellows Conductive Cooling", vol. 20, No. 11A, Apr. 1978, pp. 4391-4392. |
IBM Technical Disclosure Bulletin "Self-Regulating Evaporative/Conductive Thermal Link", vol. 21, No. 8, Jan. 1979, pp. 3281-3282. |
IBM Technical Disclosure Bulletin "Thermally Enhanced Self Leveling/Positive Contact Substrate Cap", vol. 23, No. 2, Jul. 1980, pp. 541-542. |
IBM TDB, "Module Thermal Test Chamber," vol. 24, No. 9, Feb. 1982, pp. 4650-4651. |
IBM TDB, "Automated Module Preheat Oven," vol. 25, No. 1, Jun. 1982, pp. 263-264. |
IBM TDB, "Multiple Chip Heat Sink Package," vol. 29, No. 6, Nov. 1986, pp. 2584-2585. |
IBM TDB, "Generic Burn-in for LOCST Chips," vol. 32, No. 4A, Sep. 1989, pp. 22-23. |
IBM TDB, "Non-Permanent Mounting Technique for Test and Burn-in of C4 Devices," vol. 32, No. 5A, Oct. 1989, pp. 70-71. |
IBM TDB, "Technique for a Dynamic Burn-in Test," vol. 32, No. 8B, Jan. 1990, pp. 303-305. |