“This application is a divisional of Ser. No. 08/675,093, filed Jul. 3, 1996”, now U.S. Pat. No. 6,048,435. The following U.S. patent applications, all owned by Tegal Corporation, are cross-referenced and hereby incorporated by reference: 1. Title: PLASMA ETCH REACTOR AND METHOD Inventors: Stephen P. DeOrnellas, Leslie G. Jerde Alfred Cofer, Robert C. Vail, Kurt A. Olson Ser. No.: 08/675,559 Filed: Jul. 3, 1996 Docket No.: TEGL 1008-CON-1 SRM 2. Title: PLASMA ETCH REACTOR HAVING A PLURALITY OF MAGNETS Inventors: Stephen P. DeOrnellas, Leslie G. Jerde Alfred Cofer, Robert C. Vail, Kurt A. Olson Ser. No.: 09/152,238 Filed: Sep. 11, 1998 Docket No.: TEGL 1008-DIV-1 SRM 3. Title: PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS Inventors: Stephen P. DeOrnellas, Alferd Cofer, Robert C. Vail Ser. No.: 08/675,093 Filed: Jul. 3, 1996 Docket No.: TEGL 1009 SRM 4. Title: PLASMA ETCH REACTOR AND METHOD FOR EMERGING FILMS Inventors: Stephen P. DeOrnellas, Alferd Cofer, Robert C. Vail Ser. No.: Unknown Filed: Aug. 27, 1999 Docket No.: TEGL 1009-CON-1 SRM 5. Title: IMPROVED METHOD AND APPARATUS FOR ETCHING A SEMICONDUCTOR WAFER WITH FEATURES HAVING VERTICAL SIDEWALLS Inventors: Stephen P. DeOrnellas, Alferd Cofer, Robert C. Vail Ser. No.: 08/742,861 Filed: Nov. 1, 1996 The present invention relates to an improved plasma etch reactor apparatus and method.
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