Claims
- 1. A brazed lead electrode workpiece for use in a semiconductor device comprising:
- a. an axially extending contact member formed substantially of Molylidenum and terminating at one end in a joining surface;
- 2. The workpiece of claim 1 wherein the conductive metal is selected from the group consisting of silver and copper and alloys thereof.
- 3. The workpiece of claim 2 wherein said conductive metal is copper.
- 4. The workpiece of claim 1 wherein said joining surfaces of said members are of substantially the same configuration and size.
- 5. The workpiece of claim 1 wherein said lead member joining surface is greater in cross-section than said contact member joining surface.
- 6. The workpiece of claim 1 wherein said brazing alloy comprises on a weight basis about 80-89% copper, about 15-15% silver and about 4-6% phosphorus.
- 7. The workpiece of claim 1 wherein; said thermally and electrically conductive metal is selected from the group consisting of silver, copper and alloys thereof; and said brazing alloy comprises on a weight basis about 80- 89% copper, about 5-15% silver and about 4-6% phosphorus.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of U.S. Patent Application Ser. No. 463,678, filed Apr. 24, l974, now U.S. Pat. No. 3,930,306, dated Jan. 6, l976
US Referenced Citations (4)
Non-Patent Literature Citations (1)
Entry |
"Brazing Manual" American Welding Society, 2nd edition, N.Y., 1963; pp. 39 and 40. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
463678 |
Apr 1974 |
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