Number | Date | Country | Kind |
---|---|---|---|
5-314147 | Nov 1993 | JPX | |
5-314470 | Nov 1993 | JPX | |
5-316108 | Nov 1993 | JPX | |
5-341322 | Dec 1993 | JPX | |
5-345314 | Dec 1993 | JPX | |
350297 | Dec 1993 | JPX | |
5-354139 | Dec 1993 | JPX | |
6-15505 | Feb 1994 | JPX |
This is a Division of application Ser. No. 08/298,800 filed on Aug. 31, 1994, now U.S. Pat. No. 5,738,731.
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60-153114 | Aug 1985 | JPX |
2-184594 | Jul 1990 | JPX |
2-196086 | Aug 1990 | JPX |
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6-128072 | May 1994 | JPX |
Entry |
---|
English Translation of Japanese Patent Application 1-320291, Dec. 1989. |
Patent Abstracts of Japan, vol. 14, No. 543 (C-783), Nov. 30, 1990, JP 02-229790, Sep. 12, 1990. |
Patent Abstracts of Japan, vol. 15, No. 295 (E-1094), Jul. 26, 1991, JP 03-104209, May 1, 1991. |
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J.S. Williams, "Subsurface Processing of Electronic Materials Assisted By Atomic Displacements", MRS Bulletin, vol. 17, No. 6 (Jun. 1992), pp. 47-51. |
Number | Date | Country | |
---|---|---|---|
Parent | 298800 | Aug 1994 |