Claims
- 1. A process for mounting semiconductor chips on a device with the aid of an adhesive composition, which comprises the following process steps:
- applying a UV-curable adhesive layer to regions of a temporary carrier provided as adhesion sites,
- placing semiconductor chips to be mounted over the adhesion sites on the temporary carrier with an active side opposite a later soldering site in a mirror-inverted arrangement with respect to a later mounting on the device,
- determining precise positions of the semiconductor chips on the temporary carrier (1) relative to a specified position and, if necessary, aligning the semiconductor chips in accordance with said precise positions,
- fixing positions of the semiconductor chips by irradiating the adhesive layer with UV light,
- curing the adhesive layer at elevated temperature,
- soldering a rear side of the semiconductor chips glued to the temporary carrier to the device in a soldering process, and
- releasing an adhesive bond between the semiconductor chips and the temporary carrier and dissolving substantially all adhesive residues on the semiconductor chips by a solvent.
- 2. A process as claimed in claim 1, wherein said step of determining the precise positions of the semiconductor chips on the carrier includes optical measuring by a microscope, and filtering out shorter-wave components from light used for this purpose by a color filter.
- 3. A process as claimed in claim 1, wherein light used in said step of fixing is carried by an optical waveguide.
- 4. A process as claimed in claim 1, wherein said step of soldering comprises vapor-phase soldering.
- 5. A process as claimed in claim 1, wherein said solvent used in said step of releasing comprises a photoresist stripper.
- 6. A process as claimed in claim 1, wherein said UV-curable adhesive layer is of an adhesive composition comprising:
- A) at least one monofunctional (meth)acrylate of an aliphatic or cycloaliphatic alcohol containing 6-20 carbon atoms,
- B) a polyfunctional reactive crosslinking agent based on a low-molecular-weight aliphatic polyhydric alcohol esterified with (meth)acrylic acid,
- C) oligomers or polymers containing olefinically unsaturated groups, which can be copolymerized with acrylates and have a slight crosslinking action, for the purpose of flexibilization,
- D) a photoinitiator system for UV light, and
- E) a thermally activable radical starter, from which adhesive composition an adhesive bond can be produced which is resistant to a soldering process and which can also be dissolved with a solvent after the soldering process to leave no residue.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3923023 |
Jul 1989 |
DEX |
|
Parent Case Info
This is a continuation of application Ser. No. 07/809,482, filed Feb. 21, 1992, now abandoned.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/DE90/00290 |
4/17/1990 |
|
|
2/21/1992 |
2/21/1992 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO91/01043 |
1/24/1991 |
|
|
US Referenced Citations (8)
Foreign Referenced Citations (7)
Number |
Date |
Country |
0110285A3 |
Jun 1984 |
EPX |
0142783A3 |
May 1985 |
EPX |
0150882A1 |
Aug 1985 |
EPX |
0191534A1 |
Aug 1986 |
EPX |
0253444A2 |
Jan 1988 |
EPX |
3808667A1 |
Oct 1989 |
DEX |
WO8908896 |
Sep 1989 |
WOX |
Non-Patent Literature Citations (1)
Entry |
R. W. Nufer, Chip Testing and Sorting, May 1971, IBM Technical Disclosure Bulletin, vol. 13, No. 12, p. 3652. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
809482 |
Feb 1992 |
|