This is a continuation of U.S. patent application Ser. No. 581,975, filed Feb. 21, 1984 now abandoned, which is a continuation-in-part of U.S. Ser. No. 532,391 filed Sept. 15, 1983, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3657805 | Johnson | Apr 1972 | |
3699543 | Neale | Oct 1972 | |
3781683 | Freed | Dec 1973 | |
3803709 | Beltz et al. | Apr 1974 | |
3983479 | Lee et al. | Sep 1976 | |
4021838 | Warwick | May 1977 | |
4048438 | Zimmerman | Sep 1977 | |
4074342 | Honn et al. | Feb 1978 | |
4220917 | McMahon, Jr. | Sep 1980 | |
4246595 | Noyori et al. | Jan 1981 | |
4257061 | Chapel, Jr. et al. | Mar 1981 | |
4320438 | Ibarhim et al. | Mar 1982 | |
4413308 | Brown | Nov 1983 | |
4458297 | Stopper et al. | Jul 1984 | |
4479088 | Stopper | Oct 1984 | |
4481559 | Buck et al. | Nov 1985 | |
4484215 | Pappas | Nov 1984 |
Number | Date | Country |
---|---|---|
8202603 | May 1982 | EPX |
8202640 | May 1982 | EPX |
Entry |
---|
Bodendor F et al, IBM Technical Disclosure Bulletin, Active Silicon Chip Carrier, vol. 15, No. 2, (7/72). |
32nd Electronic Components Conference, May 10-12, 1982, San Diego, pp. 7-16; IEEE, New York, U.S., Y. Hsia et al.: "A reconfigurable interconnect for insilicon electronic assembly". |
"Semiconductor Process Defect Monitor", Ghatalia et al., IBM Technical Disclos. Bulletin, vol. 17, No. 9, Feb. 1975. |
"Pluggable-Module Power-Connection Mechanism", IBM Technical Disclosure Bulletin, vol. 27, No. 10A, Mar., 1985. |
"Test Structure for Semiconductor Chips", N. E. Hallas et al, IBM Technical Disclosure Bulletin, vol. 19, No. 3, Aug., 1976. |
"Monster Chips: The Most Integrated Circuits Yet", BusinessWeek, Sep. 26, 1983, pp. 148D, 148F, 148H. |
Number | Date | Country | |
---|---|---|---|
Parent | 581975 | Feb 1984 |
Number | Date | Country | |
---|---|---|---|
Parent | 532391 | Sep 1983 |