Megica Corporation

Organization

Hsin-Chu, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thick metal interconnection scheme in IC chips
- Patent number 8,552,559
- Issue date Oct 8, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and process for forming the same
- Patent number 8,546,947
- Issue date Oct 1, 2013
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating chip package with die and substrate
- Patent number 8,535,976
- Issue date Sep 17, 2013
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top layers of metal for high performance IC's
- Patent number 8,531,038
- Issue date Sep 10, 2013
- Megica Corporation
- Mou-Shiung Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip structure
- Patent number 8,519,552
- Issue date Aug 27, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in packages
- Patent number 8,503,186
- Issue date Aug 6, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interconnect layers
- Patent number 8,492,870
- Issue date Jul 23, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnection schemes on top of IC chip
- Patent number 8,492,900
- Issue date Jul 23, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance system-on-chip using post passivation process
- Patent number 8,487,400
- Issue date Jul 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnection schemes on top of IC chip
- Patent number 8,482,127
- Issue date Jul 9, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low fabrication cost, high performance, high reliability chip scale...
- Patent number 8,481,418
- Issue date Jul 9, 2013
- Megica Corporation
- Jin Yuan Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Top layers of metal for high performance IC's
- Patent number 8,471,384
- Issue date Jun 25, 2013
- Megica Corporation
- Mou-Shiung Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated chip package structure using organic substrate and metho...
- Patent number 8,471,361
- Issue date Jun 25, 2013
- Megica Corporation
- Mou-Shiung Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit and method for fabricating the same
- Patent number 8,471,388
- Issue date Jun 25, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple selectable function integrated circuit module
- Patent number 8,471,389
- Issue date Jun 25, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnection schemes on top of IC chip
- Patent number 8,461,686
- Issue date Jun 11, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating circuit component
- Patent number 8,461,679
- Issue date Jun 11, 2013
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnection schemes on top of the IC chips
- Patent number 8,456,013
- Issue date Jun 4, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 8,456,856
- Issue date Jun 4, 2013
- Megica Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming post passivation Au layer with clean surface
- Patent number 8,440,272
- Issue date May 14, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnection schemes on top of IC chips
- Patent number 8,435,883
- Issue date May 7, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,436,449
- Issue date May 7, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level processing method and structure to manufacture semicond...
- Patent number 8,431,977
- Issue date Apr 30, 2013
- Megica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package with redistribution lines
- Patent number 8,426,958
- Issue date Apr 23, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and manufacturing method of chip scale package
- Patent number 8,426,982
- Issue date Apr 23, 2013
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-cyanide gold electroplating for fine-line gold traces and gold...
- Patent number 8,420,520
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip structure with a passive device and method for forming the same
- Patent number 8,421,158
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having a chip combined with a substrate via a copper p...
- Patent number 8,421,222
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 8,421,227
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED...
- Publication number 20140021522
- Publication date Jan 23, 2014
- MEGICA Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE IC CHIP HAVING DISCRETE DECOUPLING CAPACITORS ATTA...
- Publication number 20140021630
- Publication date Jan 23, 2014
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHO...
- Publication number 20130309812
- Publication date Nov 21, 2013
- MEGICA Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURE AND MANUFACTURING METHOD OF CHIP SCALE PACKAGE
- Publication number 20130221512
- Publication date Aug 29, 2013
- Megica Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH A PASSIVE DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20130214387
- Publication date Aug 22, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance system-on-chip inductor using post passivation pro...
- Publication number 20130193553
- Publication date Aug 1, 2013
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION...
- Publication number 20130127024
- Publication date May 23, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE AND LIGHT SENSOR CHIP PACKAGES
- Publication number 20120228681
- Publication date Sep 13, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Packages
- Publication number 20120193785
- Publication date Aug 2, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE STRUCTURES FOR SIGNAL AND/OR POWER TRANSMISSION IN A SEMI...
- Publication number 20120170887
- Publication date Jul 5, 2012
- MEGICA CORPORATION
- Ping-Jung Yang
- G02 - OPTICS
Information Patent Application
CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME
- Publication number 20120098128
- Publication date Apr 26, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT ON IC CHIP
- Publication number 20120025378
- Publication date Feb 2, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20120007237
- Publication date Jan 12, 2012
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH DIE AND SUBSTRATE
- Publication number 20110309473
- Publication date Dec 22, 2011
- MEGICA Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...
- Publication number 20110304008
- Publication date Dec 15, 2011
- Magica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reliable metal bumps on top of I/O pads after removal of test probe...
- Publication number 20110291259
- Publication date Dec 1, 2011
- MEGICA CORPORATION
- Ching-Cheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20110291272
- Publication date Dec 1, 2011
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING CHIPS
- Publication number 20110291275
- Publication date Dec 1, 2011
- MEGICA CORPORATION
- Shih-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE SELECTABLE FUNCTION INTEGRATED CIRCUIT MODULE
- Publication number 20110285018
- Publication date Nov 24, 2011
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME
- Publication number 20110285022
- Publication date Nov 24, 2011
- MEGICA Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME
- Publication number 20110278727
- Publication date Nov 17, 2011
- MEGICA CORPORATION
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE
- Publication number 20110266680
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE SUB-SYSTEM DESIGN AND ASSEMBLY
- Publication number 20110254001
- Publication date Oct 20, 2011
- MEGICA CORPORATION
- Mou-Shiung Lin
- G01 - MEASURING TESTING
Information Patent Application
STACKED CHIP PACKAGE WITH REDISTRIBUTION LINES
- Publication number 20110241183
- Publication date Oct 6, 2011
- MEGICA Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH COIL ELEMENT OVER PASSIVATION LAYER
- Publication number 20110233776
- Publication date Sep 29, 2011
- MEGICA Corporation
- Wen-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110215446
- Publication date Sep 8, 2011
- MEGICA Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
- Publication number 20110215469
- Publication date Sep 8, 2011
- MEGICA Corporation
- HSIN-JUNG LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CIRCUIT COMPONENT
- Publication number 20110215476
- Publication date Sep 8, 2011
- MEGICA Corporation
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
77630294 - POST-PASSIVATION
- Serial number 77630294
- Filing date Dec 10, 2008
- MEGICA CORPORATION
- 45 - Legal services
Information Trademark
77593962 - POST-PASSIVATION TECHNOLOGY
- Serial number 77593962
- Filing date Oct 16, 2008
- MEGICA CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77402182 - FREEWAY
- Serial number 77402182
- Registration number 3605102
- Filing date Feb 20, 2008
- MEGICA CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
78967663 - POST-PASSIVATION
- Serial number 78967663
- Registration number 3532836
- Filing date Sep 6, 2006
- MEGICA CORPORATION
- 40 - Treatment of materials
Information Trademark
78967666 - MEGIC
- Serial number 78967666
- Filing date Sep 6, 2006
- MEGICA CORPORATION
- 40 - Treatment of materials
Information Trademark
78967656 - POST PASSIVATION
- Serial number 78967656
- Filing date Sep 5, 2006
- MEGICA CORPORATION
- 35 - Advertising
Information Trademark
78838027 - MEGICA INNOVATOR OF POST-PASSIVATION TECHNOLOGY
- Serial number 78838027
- Filing date Mar 15, 2006
- MEGIC CORPORATION
- 40 - Treatment of materials
Information Trademark
78838032 - MEGICA INNOVATING POST-PASSIVATION TECHNOLOGY
- Serial number 78838032
- Filing date Mar 15, 2006
- MEGIC CORPORATION
- 40 - Treatment of materials
Information Trademark
78838015 - MEGIC INNOVATOR OF POST-PASSIVATION TECHNOLOGY
- Serial number 78838015
- Filing date Mar 15, 2006
- MEGIC CORPORATION
- 40 - Treatment of materials
Information Trademark
78838023 - MEGIC INNOVATING POST-PASSIVATION TECHNOLOGY
- Serial number 78838023
- Filing date Mar 15, 2006
- MEGIC CORPORATION
- 40 - Treatment of materials
Information Trademark
78838007 - MEGICA
- Serial number 78838007
- Filing date Mar 15, 2006
- MEGIC CORPORATION
- 40 - Treatment of materials
Information Trademark
78831271 - MEGIC INNOVATOR OF POST-PASSIVATION TECHNOLOGY
- Serial number 78831271
- Filing date Mar 7, 2006
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78831277 - MEGICA INNOVATING POST-PASSIVATION TECHNOLOGY
- Serial number 78831277
- Filing date Mar 7, 2006
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78831261 - MEGICA
- Serial number 78831261
- Filing date Mar 7, 2006
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78831267 - MEGIC INNOVATING POST-PASSIVATION TECHNOLOGY
- Serial number 78831267
- Filing date Mar 7, 2006
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78831264 - MEGICA INNOVATOR OF POST-PASSIVATION TECHNOLOGY
- Serial number 78831264
- Filing date Mar 7, 2006
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78564751 - INNOVATION FOUNDRY
- Serial number 78564751
- Filing date Feb 10, 2005
- MEGIC CORPORATION
- 35 - Advertising
Information Trademark
78564765 - INTELLECTUAL FACTORY
- Serial number 78564765
- Filing date Feb 10, 2005
- MEGIC CORPORATION
- 35 - Advertising
Information Trademark
78564759 - INVENTION FOUNDRY
- Serial number 78564759
- Filing date Feb 10, 2005
- MEGIC CORPORATION
- 35 - Advertising
Information Trademark
78533651 - EMBOSSIC
- Serial number 78533651
- Registration number 3245405
- Filing date Dec 16, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78533649 - OVERPASS
- Serial number 78533649
- Registration number 3242925
- Filing date Dec 16, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78533653 - EMBOSS-CU
- Serial number 78533653
- Registration number 3256930
- Filing date Dec 16, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78533654 - EMBOSS-AU
- Serial number 78533654
- Registration number 3256931
- Filing date Dec 16, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78476212 - POST-PASSIVATION
- Serial number 78476212
- Filing date Aug 31, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78473408 - POST PASSIVATION
- Serial number 78473408
- Filing date Aug 25, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78473419 - INTERCHANGE
- Serial number 78473419
- Registration number 3276325
- Filing date Aug 25, 2004
- MEGIC CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78098130 - FREEWAY
- Serial number 78098130
- Registration number 2666614
- Filing date Dec 13, 2001
- Megic Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Megica Corporation

Organization

Patents Grantslast 30 patents

Post passivation structure for a semiconductor device and packaging...

Very thick metal interconnection scheme in IC chips

Chip structure and process for forming the same

Method for fabricating chip package with die and substrate

Top layers of metal for high performance IC's

Chip structure

System-in packages

Semiconductor package with interconnect layers

Post passivation interconnection schemes on top of IC chip

High performance system-on-chip using post passivation process

Post passivation interconnection schemes on top of IC chip

Low fabrication cost, high performance, high reliability chip scale...

Top layers of metal for high performance IC's

Integrated chip package structure using organic substrate and metho...

Integrated circuit and method for fabricating the same

Multiple selectable function integrated circuit module

Post passivation interconnection schemes on top of IC chip

Method for fabricating circuit component

Post passivation interconnection schemes on top of the IC chips

Integrated circuit chip using top post-passivation technology and b...

Method for forming post passivation Au layer with clean surface

Post passivation interconnection schemes on top of IC chips

Chip package and method for fabricating the same

Wafer level processing method and structure to manufacture semicond...

Stacked chip package with redistribution lines

Structure and manufacturing method of chip scale package

Non-cyanide gold electroplating for fine-line gold traces and gold...

Chip structure with a passive device and method for forming the same

Chip package having a chip combined with a substrate via a copper p...

Semiconductor chip structure

Patents Applicationslast 30 patents

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED...

HIGH PERFORMANCE IC CHIP HAVING DISCRETE DECOUPLING CAPACITORS ATTA...

INTEGRATED CHIP PACKAGE STRUCTURE USING CERAMIC SUBSTRATE AND METHO...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

STRUCTURE AND MANUFACTURING METHOD OF CHIP SCALE PACKAGE

CHIP STRUCTURE WITH A PASSIVE DEVICE AND METHOD FOR FORMING THE SAME

High performance system-on-chip inductor using post passivation pro...

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION...

IMAGE AND LIGHT SENSOR CHIP PACKAGES

Multichip Packages

WAVEGUIDE STRUCTURES FOR SIGNAL AND/OR POWER TRANSMISSION IN A SEMI...

CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

SOLDER INTERCONNECT ON IC CHIP

CHIP PACKAGE

CHIP PACKAGE WITH DIE AND SUBSTRATE

WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...

Reliable metal bumps on top of I/O pads after removal of test probe...

CHIP STRUCTURE

METHOD OF ASSEMBLING CHIPS

MULTIPLE SELECTABLE FUNCTION INTEGRATED CIRCUIT MODULE

INTEGRATED CIRCUIT AND METHOD FOR FABRICATING THE SAME

CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME

CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

HIGH PERFORMANCE SUB-SYSTEM DESIGN AND ASSEMBLY

STACKED CHIP PACKAGE WITH REDISTRIBUTION LINES

SEMICONDUCTOR CHIP WITH COIL ELEMENT OVER PASSIVATION LAYER

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

METHOD FOR FABRICATING CIRCUIT COMPONENT

Trademarklast 30 trademarks

77630294 - POST-PASSIVATION

77593962 - POST-PASSIVATION TECHNOLOGY

77402182 - FREEWAY

78967663 - POST-PASSIVATION

78967666 - MEGIC

78967656 - POST PASSIVATION

78838027 - MEGICA INNOVATOR OF POST-PASSIVATION TECHNOLOGY

78838032 - MEGICA INNOVATING POST-PASSIVATION TECHNOLOGY

78838015 - MEGIC INNOVATOR OF POST-PASSIVATION TECHNOLOGY

78838023 - MEGIC INNOVATING POST-PASSIVATION TECHNOLOGY

78838007 - MEGICA

78831271 - MEGIC INNOVATOR OF POST-PASSIVATION TECHNOLOGY

78831277 - MEGICA INNOVATING POST-PASSIVATION TECHNOLOGY

78831261 - MEGICA

78831267 - MEGIC INNOVATING POST-PASSIVATION TECHNOLOGY